IRF7329TRPBF
- Mfr.Part #
- IRF7329TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 12V 9.2A 8-SOIC
- Stock
- 6,380
- In Stock :
- 6,380
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- FET Type :
- 2 P-Channel (Dual)
- Input Capacitance (Ciss) (Max) @ Vds :
- 3450pF @ 10V
- Number of Elements :
- 2
- Transistor Application :
- SWITCHING
- Gate to Source Voltage (Vgs) :
- 8V
- Continuous Drain Current (ID) :
- 9.2A
- Packaging :
- Tape and Reel (TR)
- Current Rating :
- -9.2A
- Turn On Delay Time :
- 10 ns
- Operating Mode :
- ENHANCEMENT MODE
- RoHS Status :
- ROHS3 Compliant
- Fall Time (Typ) :
- 260 ns
- Drain-source On Resistance-Max :
- 0.017Ohm
- Number of Terminations :
- 8
- Drain to Source Voltage (Vdss) :
- 12V
- Operating Temperature :
- -55°C~150°C TJ
- Series :
- HEXFET®
- Rds On (Max) @ Id, Vgs :
- 17m Ω @ 9.2A, 4.5V
- Factory Lead Time :
- 12 Weeks
- Turn-Off Delay Time :
- 340 ns
- Number of Pins :
- 8
- Transistor Element Material :
- SILICON
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Width :
- 3.9878mm
- Height :
- 1.4986mm
- Published :
- 2004
- FET Feature :
- Logic Level Gate
- Element Configuration :
- Dual
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Power Dissipation :
- 2W
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mounting Type :
- Surface Mount
- Max Power Dissipation :
- 2W
- Vgs(th) (Max) @ Id :
- 900mV @ 250μA
- Base Part Number :
- IRF7329PBF
- Length :
- 4.9784mm
- Voltage - Rated DC :
- -12V
- Drain to Source Breakdown Voltage :
- -12V
- Gate Charge (Qg) (Max) @ Vgs :
- 57nC @ 4.5V
- Terminal Form :
- Gull wing
- Lead Free :
- Lead Free
- Radiation Hardening :
- No
- Mount :
- Surface Mount
- Rise Time :
- 8.6ns
- Datasheets
- IRF7329TRPBF

IRF7329TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7329TRPBF Description
Intrative Rectifier's new P-channel HEXFET power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged device design of HEXFET Power MOSFET, provides designers with an extremely efficient and reliable device for use in a variety of applications. Over the years, SO-8 has been improved through customized thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to greatly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.
IRF7329TRPBF Features
Trench Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Low Profile (<1.8mm)
Available in Tape & Reel
Lead-Free
IRF7329TRPBF Applications
making it an ideal choice for a variety of power applications
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