IRF7329TRPBF
- Mfr.Part #
- IRF7329TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 12V 9.2A 8-SOIC
- Stock
- 6,380
- In Stock :
- 6,380
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Transistor Application :
- SWITCHING
- Power Dissipation :
- 2W
- Transistor Element Material :
- SILICON
- Lead Free :
- Lead Free
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Packaging :
- Tape and Reel (TR)
- Published :
- 2004
- Rds On (Max) @ Id, Vgs :
- 17m Ω @ 9.2A, 4.5V
- Gate to Source Voltage (Vgs) :
- 8V
- Operating Mode :
- ENHANCEMENT MODE
- Terminal Form :
- Gull wing
- Input Capacitance (Ciss) (Max) @ Vds :
- 3450pF @ 10V
- Radiation Hardening :
- No
- Rise Time :
- 8.6ns
- Voltage - Rated DC :
- -12V
- Turn On Delay Time :
- 10 ns
- Gate Charge (Qg) (Max) @ Vgs :
- 57nC @ 4.5V
- Drain to Source Breakdown Voltage :
- -12V
- Drain-source On Resistance-Max :
- 0.017Ohm
- Mounting Type :
- Surface Mount
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- FET Feature :
- Logic Level Gate
- Height :
- 1.4986mm
- Width :
- 3.9878mm
- Max Power Dissipation :
- 2W
- Mount :
- Surface Mount
- Turn-Off Delay Time :
- 340 ns
- Drain to Source Voltage (Vdss) :
- 12V
- Number of Elements :
- 2
- Current Rating :
- -9.2A
- Number of Terminations :
- 8
- Length :
- 4.9784mm
- Series :
- HEXFET®
- FET Type :
- 2 P-Channel (Dual)
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 8
- Base Part Number :
- IRF7329PBF
- Vgs(th) (Max) @ Id :
- 900mV @ 250μA
- Element Configuration :
- Dual
- Continuous Drain Current (ID) :
- 9.2A
- Factory Lead Time :
- 12 Weeks
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Operating Temperature :
- -55°C~150°C TJ
- Fall Time (Typ) :
- 260 ns
- Datasheets
- IRF7329TRPBF

IRF7329TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7329TRPBF Description
Intrative Rectifier's new P-channel HEXFET power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged device design of HEXFET Power MOSFET, provides designers with an extremely efficient and reliable device for use in a variety of applications. Over the years, SO-8 has been improved through customized thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to greatly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.
IRF7329TRPBF Features
Trench Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Low Profile (<1.8mm)
Available in Tape & Reel
Lead-Free
IRF7329TRPBF Applications
making it an ideal choice for a variety of power applications
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