IRF7304
- Mfr.Part #
- IRF7304
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 20V 4.3A 8-SOIC
- Stock
- 192
- In Stock :
- 192
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Packaging :
- Tube
- Published :
- 1997
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Drain to Source Voltage (Vdss) :
- 20V
- Mounting Type :
- Surface Mount
- Input Capacitance (Ciss) (Max) @ Vds :
- 610pF @ 15V
- Gate Charge (Qg) (Max) @ Vgs :
- 22nC @ 4.5V
- JESD-30 Code :
- R-PDSO-G8
- Operating Temperature :
- -55°C~150°C TJ
- Operating Mode :
- ENHANCEMENT MODE
- Series :
- HEXFET®
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of Elements :
- 2
- Additional Feature :
- LOGIC LEVEL COMPATIBLE
- RoHS Status :
- Non-RoHS Compliant
- ECCN Code :
- EAR99
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- JESD-609 Code :
- e0
- FET Feature :
- Logic Level Gate
- Vgs(th) (Max) @ Id :
- 700mV @ 250μA
- Rds On (Max) @ Id, Vgs :
- 90m Ω @ 2.2A, 4.5V
- Transistor Element Material :
- SILICON
- Current - Continuous Drain (Id) @ 25°C :
- 4.3A
- Number of Terminations :
- 8
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Drain-source On Resistance-Max :
- 0.09Ohm
- DS Breakdown Voltage-Min :
- 20V
- Power - Max :
- 2W
- Drain Current-Max (Abs) (ID) :
- 3.6A
- FET Type :
- 2 P-Channel (Dual)
- Peak Reflow Temperature (Cel) :
- 245
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Terminal Form :
- Gull wing
- HTS Code :
- 8541.29.00.95
- Qualification Status :
- Not Qualified
- Datasheets
- IRF7304

IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7304 Description
The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.
The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.
IRF7304 Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
IRF7304 Applications
provides designers with an extremely efficient device used in a variety of applications.
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