FDP26N40
- Mfr.Part #
- FDP26N40
- Manufacturer
- onsemi
- Package / Case
- TO-220-3
- Datasheet
- Download
- Description
- MOSFET N-CH 400V 26A TO220-3
- Stock
- 13,478
- In Stock :
- 13,478
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Gate to Source Voltage (Vgs) :
- 30V
- Package / Case :
- TO-220-3
- Number of Elements :
- 1
- Height :
- 15.38mm
- Turn On Delay Time :
- 45 ns
- Gate Charge (Qg) (Max) @ Vgs :
- 60nC @ 10V
- Radiation Hardening :
- No
- Continuous Drain Current (ID) :
- 26A
- ECCN Code :
- EAR99
- Resistance :
- 160mOhm
- Series :
- UniFET™
- Width :
- 4.7mm
- Element Configuration :
- Single
- Fall Time (Typ) :
- 66 ns
- Current - Continuous Drain (Id) @ 25°C :
- 26A Tc
- Input Capacitance (Ciss) (Max) @ Vds :
- 3185pF @ 25V
- Pbfree Code :
- yes
- Mount :
- Through Hole
- Vgs(th) (Max) @ Id :
- 5V @ 250μA
- Lifecycle Status :
- ACTIVE (Last Updated: 3 days ago)
- Packaging :
- Tube
- JEDEC-95 Code :
- TO-220AB
- Mounting Type :
- Through Hole
- Rds On (Max) @ Id, Vgs :
- 160m Ω @ 13A, 10V
- Transistor Application :
- SWITCHING
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Vgs (Max) :
- ±30V
- RoHS Status :
- ROHS3 Compliant
- Transistor Element Material :
- SILICON
- Number of Pins :
- 3
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Weight :
- 1.8g
- REACH SVHC :
- No SVHC
- Factory Lead Time :
- 5 Weeks
- Drain to Source Breakdown Voltage :
- 400V
- Length :
- 10.1mm
- JESD-609 Code :
- e3
- FET Type :
- N-Channel
- Additional Feature :
- AVALANCHE RATED
- Number of Terminations :
- 3
- Power Dissipation-Max :
- 265W Tc
- Operating Mode :
- ENHANCEMENT MODE
- Rise Time :
- 100ns
- Power Dissipation :
- 265W
- Published :
- 2013
- Lead Free :
- Lead Free
- Operating Temperature :
- -55°C~150°C TJ
- Turn-Off Delay Time :
- 115 ns
- Contact Plating :
- Tin
- Datasheets
- FDP26N40

N-Channel Tube 160m Ω @ 13A, 10V ±30V 3185pF @ 25V 60nC @ 10V TO-220-3
FDP26N40 IC is a type of UniFET? N-channel MOSFET with high voltage, which is able to provide better switching performance, higher avanlanche engergy strength, and is especially tailored to minimize on-state resistance based on planar stripe and DMOS technology. Moreover, it is able to withstand surge stresses in excess of 2000V HBM based on the internal gate-source ESD diodes. FDP26N40 is designed with excellent reliability in its performance, including the reduction in voltage spikes and overshoot, reduction in junction capacitance and reverse recovery charge, as well as elimination of additional external components, thus ensuring the system features long runtimes. It can be integrated into a variety of industrial-standard and thermally enhanced packages based on advanced silicon technology.
FDP26N40 Features
Planar stripe and DMOS technology
Better switching performance
High avanlanche energy strength
Improved dv/dt capability
Capacity to reduce on-state resistance
Voltage across the gate and source of 400V
Operating and storage temperature range of -55 to +150°C
Mounted in the way of through hole
Available in the TO-220-3 package
FDP26N40 Applications
Power factor correction (PFC)
Flat panel display (FPD) TV power
ATX (advanced technology extended)
Electronic lamp ballasts
Uninterruptible power supplies
AC-DC power supplies
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