IRLL024NPBF

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Mfr.Part #
IRLL024NPBF
Manufacturer
Infineon Technologies
Package / Case
TO-261-4, TO-261AA
Datasheet
Download
Description
MOSFET N-CH 55V 3.1A SOT223
Stock
46,266
In Stock :
46,266

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Manufacturer :
Infineon Technologies
Product Category :
Transistors - FETs, MOSFETs - Single
Packaging :
Tube
Input Capacitance (Ciss) (Max) @ Vds :
510pF @ 25V
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mounting Type :
Surface Mount
Drive Voltage (Max Rds On,Min Rds On) :
4V 10V
Operating Temperature :
-55°C~150°C TJ
Package / Case :
TO-261-4, TO-261AA
FET Type :
N-Channel
RoHS Status :
ROHS3 Compliant
Rds On (Max) @ Id, Vgs :
65m Ω @ 3.1A, 10V
Power Dissipation-Max :
1W Ta
Vgs (Max) :
±16V
Drain to Source Voltage (Vdss) :
55V
Series :
HEXFET®
Vgs(th) (Max) @ Id :
2V @ 250μA
Current - Continuous Drain (Id) @ 25°C :
3.1A Ta
ECCN Code :
EAR99
Gate Charge (Qg) (Max) @ Vgs :
15.6nC @ 5V
Published :
1999
Datasheets
IRLL024NPBF
Introducing Transistors - FETs, MOSFETs - Single Infineon Technologies IRLL024NPBF from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-55°C~150°C TJ, Package / Case:TO-261-4, TO-261AA, IRLL024NPBF pinout, IRLL024NPBF datasheet PDF, IRLL024NPBF amp .Beyond Transistors - FETs, MOSFETs - Single Infineon Technologies IRLL024NPBF ,we also offer EPC2019, EPC2053, EPC2015C, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies IRLL024NPBF


N-Channel Tube 65m Ω @ 3.1A, 10V ±16V 510pF @ 25V 15.6nC @ 5V 55V TO-261-4, TO-261AA

IRLL024NPBF Description


Fifth Generation HEXFETs achieve extraordinarily low on-resistance per silicon area by utilizing cutting-edge fabrication processes. This feature offers the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.

The SOT-223 package is made to be surface-mounted utilizing infrared, vapor phase, or wave soldering processes. As with other SOT or SOIC packages, its distinctive package shape enables simple automatic pick-and-place, but it also has the extra benefit of increased thermal efficiency thanks to an expanded tab for heat sinking. One Watt of power can be lost in a typical surface mount application.



IRLL024NPBF Features


  • Surface Mount

  • Advanced Process Technology

  • Ultra Low On-Resistance

  • Dynamic dv/dt Rating

  • Fast Switching

  • Fully Avalanche Rated

  • Lead-Free 



IRLL024NPBF Applications


  • Power Management

  • Consumer Electronics

  • Portable Devices

  • Industrial


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