IRF7663TRPBF
- Mfr.Part #
- IRF7663TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- Datasheet
- Download
- Description
- MOSFET P-CH 20V 8.2A MICRO8
- Stock
- 5,135
- In Stock :
- 5,135
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- RoHS Status :
- RoHS Compliant
- Continuous Drain Current (ID) :
- -8.2A
- Voltage - Rated DC :
- -20V
- Radiation Hardening :
- No
- Drain to Source Resistance :
- 20mOhm
- Rds On Max :
- 20 mΩ
- Min Operating Temperature :
- -55°C
- Power Dissipation-Max :
- 1.8W Ta
- Rise Time :
- 100ns
- Vgs(th) (Max) @ Id :
- 1.2V @ 250µA
- Drive Voltage (Max Rds On,Min Rds On) :
- 2.5V 4.5V
- Mount :
- Surface Mount
- Current Rating :
- -8.2A
- Power Dissipation :
- 1.8W
- Rds On (Max) @ Id, Vgs :
- 20mOhm @ 7A, 4.5V
- Input Capacitance (Ciss) (Max) @ Vds :
- 2520pF @ 10V
- Number of Pins :
- 8
- FET Type :
- P-Channel
- Number of Elements :
- 1
- Published :
- 2005
- Operating Temperature :
- -55°C~150°C TJ
- Moisture Sensitivity Level (MSL) :
- 2 (1 Year)
- Input Capacitance :
- 2.52nF
- Gate Charge (Qg) (Max) @ Vgs :
- 45nC @ 5V
- Lead Free :
- Lead Free
- Series :
- HEXFET®
- Current - Continuous Drain (Id) @ 25°C :
- 8.2A Ta
- Drain to Source Breakdown Voltage :
- -20V
- Mounting Type :
- Surface Mount
- Packaging :
- Tape and Reel (TR)
- Max Operating Temperature :
- 150°C
- Supplier Device Package :
- Micro8™
- Drain to Source Voltage (Vdss) :
- 20V
- Gate to Source Voltage (Vgs) :
- 12V
- Vgs (Max) :
- ±12V
- Package / Case :
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- Datasheets
- IRF7663TRPBF

P-Channel Tape & Reel (TR) 20mOhm @ 7A, 4.5V ±12V 2520pF @ 10V 45nC @ 5V 20V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
IRF7663TRPBF Description
New trench HEXFET? power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The new Micro8? package has half the footprint area of the standard SO-8. This makes the Micro8 an ideal package for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards.
IRF7663TRPBF Features
Trench Technology
Ultra-Low On-Resistance
P-Channel MOSFET
Very Small SOIC Package
Low Profile (<1.1mm)
Available in Tape & Reel
Lead-Free
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