IRF7410PBF
- Mfr.Part #
- IRF7410PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET P-CH 12V 16A 8SO
- Stock
- 86,171
- In Stock :
- 86,171
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Transistor Element Material :
- SILICON
- Factory Lead Time :
- 12 Weeks
- Drain Current-Max (Abs) (ID) :
- 16A
- Vgs(th) (Max) @ Id :
- 900mV @ 250μA
- Gate Charge (Qg) (Max) @ Vgs :
- 91nC @ 4.5V
- ECCN Code :
- EAR99
- RoHS Status :
- ROHS3 Compliant
- Rds On (Max) @ Id, Vgs :
- 7m Ω @ 16A, 4.5V
- Terminal Form :
- Gull wing
- Surface Mount :
- yes
- JESD-609 Code :
- e3
- Current - Continuous Drain (Id) @ 25°C :
- 16A Ta
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Drive Voltage (Max Rds On,Min Rds On) :
- 1.8V 4.5V
- Operating Temperature :
- -55°C~150°C TJ
- Drain-source On Resistance-Max :
- 0.007Ohm
- Mounting Type :
- Surface Mount
- Input Capacitance (Ciss) (Max) @ Vds :
- 8676pF @ 10V
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Series :
- HEXFET®
- Additional Feature :
- ULTRA LOW RESISTANCE
- JESD-30 Code :
- R-PDSO-G8
- DS Breakdown Voltage-Min :
- 12V
- FET Type :
- P-Channel
- JEDEC-95 Code :
- MS-012AA
- Qualification Status :
- Not Qualified
- Published :
- 2006
- Operating Mode :
- ENHANCEMENT MODE
- Terminal Position :
- Dual
- Terminal Finish :
- Matte Tin (Sn)
- Number of Terminations :
- 8
- Transistor Application :
- SWITCHING
- Number of Elements :
- 1
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max :
- 2.5W Ta
- Drain to Source Voltage (Vdss) :
- 12V
- Peak Reflow Temperature (Cel) :
- 260
- Packaging :
- Tube
- Vgs (Max) :
- ±8V
- Pulsed Drain Current-Max (IDM) :
- 65A
- Datasheets
- IRF7410PBF

P-Channel Tube 7m Ω @ 16A, 4.5V ±8V 8676pF @ 10V 91nC @ 4.5V 12V 8-SOIC (0.154, 3.90mm Width)
Description
The IRF7410PBF is a -12V single P-channel HEXFET? Power MOSFET that uses innovative processing techniques to provide low on-resistance per silicon area. This advantage offers the designer a very efficient device for battery and load management applications. The package has been upgraded with a bespoke lead frame for improved thermal performance and multiple-die capability, making it suitable for a wide range of power applications. Multiple devices can now be used in an application while using up a lot less board space thanks to these enhancements. Vapour phase, infrared, and wave soldering techniques are all supported by the package.
Features
● Ultra low on-resistance
● MOSFET with P-Channel
● Surface mount
● Tape and reel versions are available
● Lead-Free
Applications
● Power Management
● Load Switching
● Industrial
● Automotive
● DC-DC Converters
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