IRF7342D2PBF
- Mfr.Part #
- IRF7342D2PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET P-CH 55V 3.4A 8SO
- Stock
- 16,200
- In Stock :
- 16,200
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Height :
- 1.4986mm
- Power Dissipation-Max :
- 2W Ta
- Width :
- 3.9878mm
- Operating Temperature :
- -55°C~150°C TJ
- REACH SVHC :
- No SVHC
- Drain to Source Voltage (Vdss) :
- 55V
- Turn On Delay Time :
- 14 ns
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Turn-Off Delay Time :
- 43 ns
- ECCN Code :
- EAR99
- Radiation Hardening :
- No
- Length :
- 4.9784mm
- Rise Time :
- 10ns
- Termination :
- SMD/SMT
- Mounting Type :
- Surface Mount
- Dual Supply Voltage :
- -55V
- Continuous Drain Current (ID) :
- -3.4A
- Mount :
- Surface Mount
- Current - Continuous Drain (Id) @ 25°C :
- 3.4A Ta
- Threshold Voltage :
- -1V
- Gate Charge (Qg) (Max) @ Vgs :
- 38nC @ 10V
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Vgs(th) (Max) @ Id :
- 1V @ 250μA
- FET Feature :
- Schottky Diode (Isolated)
- Resistance :
- 105mOhm
- Gate to Source Voltage (Vgs) :
- 20V
- Rds On (Max) @ Id, Vgs :
- 105m Ω @ 3.4A, 10V
- Number of Elements :
- 1
- Configuration :
- Single
- FET Type :
- P-Channel
- Input Capacitance (Ciss) (Max) @ Vds :
- 690pF @ 25V
- RoHS Status :
- RoHS Compliant
- Power Dissipation :
- 2W
- Packaging :
- Tube
- Voltage - Rated DC :
- -55V
- Drain to Source Breakdown Voltage :
- -55V
- Current Rating :
- -3.4A
- Nominal Vgs :
- -1 V
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Vgs (Max) :
- ±20V
- Number of Pins :
- 8
- Fall Time (Typ) :
- 22 ns
- Published :
- 2004
- Series :
- FETKY™
- Lead Free :
- Lead Free
- Datasheets
- IRF7342D2PBF

P-Channel Tube 105m Ω @ 3.4A, 10V ±20V 690pF @ 25V 38nC @ 10V 55V 8-SOIC (0.154, 3.90mm Width)
IRF7342D2PBF Description
IRF7342D2PBF is a 55V Dual P-Channel HEXFET Power MOSFET in a SO-8 package. IRF7342D2PBF achieves extraordinarily low on-resistance per silicon area by utilizing cutting-edge production techniques. This feature offers the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
IRF7342D2PBF is appropriate in a range of power applications since the SO-8 has been upgraded through a unique lead frame for improved thermal properties and multiple-die capability. These upgrades allow for the usage of many devices while drastically reducing board space in an application. The IRF7342D2PBF package is made for infrared, vapor phase, or wave soldering processes. In a typical PCB mount application, it is possible to dissipate more power than 0.8W.
IRF7342D2PBF Features
-
Capable of being wave-soldered
-
Planar cell structure for wide SOA
-
Optimized for broadest availability from distribution partners
-
Product qualification according to JEDEC standard
-
Silicon optimized for applications switching below <100KHz
-
Industry-standard surface-mount power package
-
RoHS Compliant
-
Low RDS(on)
-
Dynamic dv/dt Rating
-
Fast Switching
-
Dual P-Channel MOSFET
IRF7342D2PBF Applications
-
High Current
-
Motor Control
-
Audio Amplifiers
-
High-Speed Switching
-
Uninterruptible Power Supply (UPS)
-
Industrial Actuators
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