FDG6303N

Manufacturer :

onsemi

Product Category :

Transistors - FETs, MOSFETs - Arrays

Current Rating :

500mA

Width :

1.25mm

Turn On Delay Time :

3 ns

Turn-Off Delay Time :

17 ns

Drain to Source Breakdown Voltage :

25V

Lead Free :

Lead Free

Voltage - Rated DC :

25V

REACH SVHC :

No SVHC

FET Type :

2 N-Channel (Dual)

Drain Current-Max (Abs) (ID) :

0.5A

Pbfree Code :

yes

Vgs(th) (Max) @ Id :

1.5V @ 250µA

Terminal Form :

Gull wing

ECCN Code :

EAR99

Element Configuration :

Dual

Factory Lead Time :

10 Weeks

Transistor Application :

SWITCHING

Operating Mode :

ENHANCEMENT MODE

Fall Time (Typ) :

8.5 ns

Mounting Type :

Surface Mount

Rise Time :

8.5ns

Gate Charge (Qg) (Max) @ Vgs :

2.3nC @ 4.5V

Threshold Voltage :

800mV

Additional Feature :

LOGIC LEVEL COMPATIBLE

Dual Supply Voltage :

25V

Radiation Hardening :

No

Transistor Element Material :

SILICON

Weight :

28mg

Package / Case :

6-TSSOP, SC-88, SOT-363

Published :

1999

Power Dissipation :

300mW

Contact Plating :

Tin

Mount :

Surface Mount

Rds On (Max) @ Id, Vgs :

450m Ω @ 500mA, 4.5V

FET Technology :

METAL-OXIDE SEMICONDUCTOR

RoHS Status :

ROHS3 Compliant

Resistance :

450mOhm

FET Feature :

Logic Level Gate

Length :

2mm

Number of Terminations :

6

Gate to Source Voltage (Vgs) :

8V

Lifecycle Status :

ACTIVE (Last Updated: 2 days ago)

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Input Capacitance (Ciss) (Max) @ Vds :

50pF @ 10V

JESD-609 Code :

e3

Nominal Vgs :

800 mV

Continuous Drain Current (ID) :

500mA

Number of Elements :

2

Height :

1mm

Termination :

SMD/SMT

Operating Temperature :

-55°C~150°C TJ

Packaging :

Tape and Reel (TR)

Max Power Dissipation :

300mW

Number of Pins :

6