FDG6301N

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Mfr.Part #
FDG6301N
Manufacturer
onsemi
Package / Case
6-TSSOP, SC-88, SOT-363
Datasheet
Download
Description
MOSFET 2N-CH 25V 0.22A SC70-6
Stock
2,298
In Stock :
2,298

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Manufacturer :
onsemi
Product Category :
Transistors - FETs, MOSFETs - Arrays
FET Technology :
METAL-OXIDE SEMICONDUCTOR
Dual Supply Voltage :
25V
Fall Time (Typ) :
4.5 ns
Power Dissipation :
300mW
JESD-609 Code :
e3
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Termination :
SMD/SMT
Number of Terminations :
6
Current Rating :
220mA
FET Feature :
Logic Level Gate
Length :
2mm
Transistor Element Material :
SILICON
Contact Plating :
Tin
Element Configuration :
Dual
Lifecycle Status :
ACTIVE (Last Updated: 2 days ago)
FET Type :
2 N-Channel (Dual)
Gate Charge (Qg) (Max) @ Vgs :
0.4nC @ 4.5V
Max Junction Temperature (Tj) :
150°C
RoHS Status :
ROHS3 Compliant
Voltage - Rated DC :
25V
Resistance :
4Ohm
Pbfree Code :
yes
Mount :
Surface Mount
REACH SVHC :
No SVHC
Threshold Voltage :
850mV
Drain to Source Breakdown Voltage :
25V
Width :
1.25mm
Rds On (Max) @ Id, Vgs :
4 Ω @ 220mA, 4.5V
Terminal Form :
Gull wing
ECCN Code :
EAR99
Max Power Dissipation :
300mW
Rise Time :
4.5ns
Input Capacitance (Ciss) (Max) @ Vds :
9.5pF @ 10V
Number of Pins :
6
Additional Feature :
LOGIC LEVEL COMPATIBLE
Operating Mode :
ENHANCEMENT MODE
Continuous Drain Current (ID) :
220mA
Number of Elements :
2
Lead Free :
Lead Free
Package / Case :
6-TSSOP, SC-88, SOT-363
Height :
1.1mm
Turn-Off Delay Time :
4 ns
Packaging :
Tape and Reel (TR)
Transistor Application :
SWITCHING
Published :
1999
Gate to Source Voltage (Vgs) :
8V
Operating Temperature :
-55°C~150°C TJ
Mounting Type :
Surface Mount
Weight :
28mg
Radiation Hardening :
No
Turn On Delay Time :
5 ns
Vgs(th) (Max) @ Id :
1.5V @ 250µA
Factory Lead Time :
10 Weeks
Datasheets
FDG6301N
Introducing Transistors - FETs, MOSFETs - Arrays onsemi FDG6301N from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:6, Number of Pins:6, Package / Case:6-TSSOP, SC-88, SOT-363, Operating Temperature:-55°C~150°C TJ, Mounting Type:Surface Mount, FDG6301N pinout, FDG6301N datasheet PDF, FDG6301N amp .Beyond Transistors - FETs, MOSFETs - Arrays onsemi FDG6301N ,we also offer SSM6N57NU,LF, DMN2004DMK-7, AO4629, Our vast inventory has you covered. Contact us now for immediate solutions.

onsemi FDG6301N


FDG6301N datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available at

FDG6301N MOSFET Description


Onsemi's patented, high cell density, DMOS technology is used to manufacture the FDG6301N dual N-Channel logic level enhancement MOSFET. This ultra-high-density technique is specifically designed to reduce on-state resistance. This device was created to replace bipolar digital transistors and tiny signal MOSFETs in low voltage applications. The FDG6301N MOSFET is widely renowned for its low drain-on-resistance and durable ESD architecture.



FDG6301N MOSFET Features


  • 25 V, 0.22 A continuous, 0.65 A peak

  • Low RDS(ON) = 4 Ω @ VGS= 4.5 V

  • Very low-level gate drive requirements allow direct operation in 3 V circuits (VGS(th) < 1.5 V).

  • Gate-Source Zener for ESD ruggedness

  • Compact industry standard SC70-6 surface mount package



FDG6301N MOSFET Applications


  • High Current, High-Speed Switching

  • Up to 12s Battery Power Tools

  • Buck Converters

  • Power Converters with Multi-Megahertz Operation

  • Three-Phase Bridge for Brushless DC Motor Control

  • Lighting Applications

  • Other Half and Full-Bridge Topologies

  • Off-Line Power Supplies

  • PFC Controllers

  • Adapters

  • Battery Management

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