BSC010NE2LSATMA1
- Mfr.Part #
- BSC010NE2LSATMA1
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-PowerTDFN
- Datasheet
- Download
- Description
- MOSFET N-CH 25V 39A/100A TDSON
- Stock
- 149,676
- In Stock :
- 149,676
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Operating Temperature :
- -55°C~150°C TJ
- Power Dissipation-Max :
- 2.5W Ta 96W Tc
- Mount :
- Surface Mount
- Rds On (Max) @ Id, Vgs :
- 1mOhm @ 30A, 10V
- Max Operating Temperature :
- 150°C
- Current - Continuous Drain (Id) @ 25°C :
- 39A Ta 100A Tc
- Input Capacitance (Ciss) (Max) @ Vds :
- 4700pF @ 12V
- Packaging :
- Tape and Reel (TR)
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Mounting Type :
- Surface Mount
- FET Type :
- N-Channel
- Number of Pins :
- 8
- RoHS Status :
- ROHS3 Compliant
- Rise Time :
- 6ns
- Series :
- OptiMOS™
- Power Dissipation :
- 96W
- Supplier Device Package :
- PG-TDSON-8-7
- Drain to Source Resistance :
- 800μOhm
- Drain to Source Voltage (Vdss) :
- 25V
- Number of Elements :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- Gate to Source Voltage (Vgs) :
- 20V
- Contact Plating :
- Tin
- Min Operating Temperature :
- -55°C
- Vgs (Max) :
- ±20V
- Gate Charge (Qg) (Max) @ Vgs :
- 64nC @ 10V
- Continuous Drain Current (ID) :
- 39A
- Package / Case :
- 8-PowerTDFN
- Published :
- 2012
- Factory Lead Time :
- 26 Weeks
- Datasheets
- BSC010NE2LSATMA1

N-Channel Tape & Reel (TR) 1mOhm @ 30A, 10V ±20V 4700pF @ 12V 64nC @ 10V 25V 8-PowerTDFN
BSC010NE2LSATMA1 Description
The BSC010NE2LSATMA1 creates a SO-8-sized footprint and 0.7 mm profile package with the lowest on-state resistance possible by fusing the most advanced HEXFET? Power MOSFET Silicon technology with cutting-edge DirectFETTM packaging. The DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly machinery, and vapor phase, infrared, or convection soldering techniques when application note AN-1035 outlining the manufacturing processes and methods is followed. The two-sided cooling of the DirectFET package reduces thermal resistance by 80% over the previous best while increasing thermal transfer in power systems.
BSC010NE2LSATMA1 Features
?High-performance Buck converter optimized
?Very low on-resistance at Vgs=4.5 V
100% of avalanches were tested
Excellent heat resistance
N'cha nnel
?JEDEC1-qualified for the intended applications
?Pb-free lead plating; complies with RoHS
?In accordance with IEC61249-2-21, halogen-free
BSC010NE2LSATMA1 Applications
Switching applications
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