IRFL024NPBF
- Mfr.Part #
- IRFL024NPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-261-4, TO-261AA
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 2.8A SOT223
- Stock
- 20,502
- In Stock :
- 20,502
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Current - Continuous Drain (Id) @ 25°C :
- 2.8A Ta
- JESD-609 Code :
- e3
- Vgs (Max) :
- ±20V
- Drain to Source Voltage (Vdss) :
- 55V
- Transistor Element Material :
- SILICON
- Gate Charge (Qg) (Max) @ Vgs :
- 18.3nC @ 10V
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max :
- 1W Ta
- Series :
- HEXFET®
- Terminal Finish :
- Matte Tin (Sn)
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Published :
- 1999
- Rds On (Max) @ Id, Vgs :
- 75m Ω @ 2.8A, 10V
- Operating Temperature :
- -55°C~150°C TJ
- Drain-source On Resistance-Max :
- 0.075Ohm
- Operating Mode :
- ENHANCEMENT MODE
- Factory Lead Time :
- 20 Weeks
- Terminal Form :
- Gull wing
- ECCN Code :
- EAR99
- Surface Mount :
- yes
- Terminal Position :
- Dual
- RoHS Status :
- ROHS3 Compliant
- Additional Feature :
- AVALANCHE RATED
- Reach Compliance Code :
- not_compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Drain Current-Max (Abs) (ID) :
- 2.8A
- Input Capacitance (Ciss) (Max) @ Vds :
- 400pF @ 25V
- Mounting Type :
- Surface Mount
- Package / Case :
- TO-261-4, TO-261AA
- FET Type :
- N-Channel
- Number of Elements :
- 1
- Transistor Application :
- SWITCHING
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 260
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Case Connection :
- DRAIN
- JESD-30 Code :
- R-PDSO-G4
- Number of Terminations :
- 4
- Qualification Status :
- Not Qualified
- DS Breakdown Voltage-Min :
- 55V
- Datasheets
- IRFL024NPBF
IRFL024NPBF Documents

N-Channel Tube 75m Ω @ 2.8A, 10V ±20V 400pF @ 25V 18.3nC @ 10V 55V TO-261-4, TO-261AA
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.
IRFL024NPBF Features
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
Lead-Free
IRFL024NPBF Applications
Switching Applications
New Energy Vehicle
Photovoltaic Generation
Wind Power Generation
Smart Grid
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