IRFL024NPBF
- Mfr.Part #
- IRFL024NPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-261-4, TO-261AA
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 2.8A SOT223
- Stock
- 20,502
- In Stock :
- 20,502
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- JESD-609 Code :
- e3
- Drain Current-Max (Abs) (ID) :
- 2.8A
- Transistor Element Material :
- SILICON
- Qualification Status :
- Not Qualified
- Drain to Source Voltage (Vdss) :
- 55V
- Number of Terminations :
- 4
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Reach Compliance Code :
- not_compliant
- Current - Continuous Drain (Id) @ 25°C :
- 2.8A Ta
- Operating Mode :
- ENHANCEMENT MODE
- Additional Feature :
- AVALANCHE RATED
- Drain-source On Resistance-Max :
- 0.075Ohm
- FET Type :
- N-Channel
- Terminal Finish :
- Matte Tin (Sn)
- Number of Elements :
- 1
- Peak Reflow Temperature (Cel) :
- 260
- Surface Mount :
- yes
- Operating Temperature :
- -55°C~150°C TJ
- JESD-30 Code :
- R-PDSO-G4
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Power Dissipation-Max :
- 1W Ta
- Factory Lead Time :
- 20 Weeks
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Packaging :
- Tube
- Transistor Application :
- SWITCHING
- Case Connection :
- DRAIN
- Rds On (Max) @ Id, Vgs :
- 75m Ω @ 2.8A, 10V
- Gate Charge (Qg) (Max) @ Vgs :
- 18.3nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds :
- 400pF @ 25V
- ECCN Code :
- EAR99
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Package / Case :
- TO-261-4, TO-261AA
- DS Breakdown Voltage-Min :
- 55V
- Series :
- HEXFET®
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- Dual
- Published :
- 1999
- Mounting Type :
- Surface Mount
- Vgs (Max) :
- ±20V
- Terminal Form :
- Gull wing
- Datasheets
- IRFL024NPBF

N-Channel Tube 75m Ω @ 2.8A, 10V ±20V 400pF @ 25V 18.3nC @ 10V 55V TO-261-4, TO-261AA
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pick-and-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.
IRFL024NPBF Features
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
Lead-Free
IRFL024NPBF Applications
Switching Applications
New Energy Vehicle
Photovoltaic Generation
Wind Power Generation
Smart Grid
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