NTD5802NT4G
- Mfr.Part #
- NTD5802NT4G
- Manufacturer
- onsemi
- Package / Case
- TO-252-3, DPak (2 Leads + Tab), SC-63
- Datasheet
- Download
- Description
- MOSFET N-CH 40V 16.4A/101A DPAK
- Stock
- 19,248
- In Stock :
- 19,248
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Package / Case :
- TO-252-3, DPak (2 Leads + Tab), SC-63
- Terminal Finish :
- Tin (Sn)
- Element Configuration :
- Single
- Current - Continuous Drain (Id) @ 25°C :
- 16.4A Ta 101A Tc
- Number of Elements :
- 1
- Drain-source On Resistance-Max :
- 0.0078Ohm
- Width :
- 6.22mm
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e3
- Lifecycle Status :
- ACTIVE (Last Updated: 1 day ago)
- FET Type :
- N-Channel
- Power Dissipation-Max :
- 2.5W Ta 93.75W Tc
- Fall Time (Typ) :
- 8.5 ns
- Vgs (Max) :
- ±20V
- Terminal Form :
- Gull wing
- Drain to Source Breakdown Voltage :
- 40V
- Gate Charge (Qg) (Max) @ Vgs :
- 100nC @ 10V
- Lead Free :
- Lead Free
- Turn On Delay Time :
- 14 ns
- Gate to Source Voltage (Vgs) :
- 20V
- Rds On (Max) @ Id, Vgs :
- 4.4m Ω @ 50A, 10V
- Avalanche Energy Rating (Eas) :
- 240 mJ
- Case Connection :
- DRAIN
- JESD-30 Code :
- R-PSSO-G2
- Power Dissipation :
- 93.75W
- Height :
- 2.38mm
- Number of Terminations :
- 2
- Pbfree Code :
- yes
- Transistor Application :
- SWITCHING
- Input Capacitance (Ciss) (Max) @ Vds :
- 5025pF @ 25V
- Transistor Element Material :
- SILICON
- Surface Mount :
- yes
- Vgs(th) (Max) @ Id :
- 3.5V @ 250µA
- Packaging :
- Tape and Reel (TR)
- Operating Temperature :
- -55°C~175°C TJ
- Operating Mode :
- ENHANCEMENT MODE
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Published :
- 2007
- Pin Count :
- 3
- Radiation Hardening :
- No
- Factory Lead Time :
- 14 Weeks
- Turn-Off Delay Time :
- 39 ns
- Length :
- 6.73mm
- Number of Pins :
- 3
- Rise Time :
- 52ns
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- EAR99
- Continuous Drain Current (ID) :
- 16.4A
- Drive Voltage (Max Rds On,Min Rds On) :
- 5V 10V
- Datasheets
- NTD5802NT4G

N-Channel Tape & Reel (TR) 4.4m Ω @ 50A, 10V ±20V 5025pF @ 25V 100nC @ 10V TO-252-3, DPak (2 Leads + Tab), SC-63
NTD5802NT4G Overview
This type of breakdown is known as "avalanche breakdown", and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 240 mJ.The maximum input capacitance of this device is 5025pF @ 25V, because the input capacitance of an op amp is defined as the difference between the input terminals with one input grounded.Continuous drain current (ID) is the maximum continuous current (ID) the device can conduct, and it is 16.4A.When VGS=40V, and ID flows to VDS at 40VVDS, the drain-source breakdown voltage is 40V in this device.Before drain current conduction can begin, the device's turn-off delay time must be charged up to full capacitance. This value is 39 ns.During device turn-on, the input capacitance must be charged for a period of time before drain current conduction can begin, so its delay time is 14 ns seconds.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.Using drive voltage (5V 10V), this device helps reduce its power consumption.
NTD5802NT4G Features
the avalanche energy rating (Eas) is 240 mJ
a continuous drain current (ID) of 16.4A
a drain-to-source breakdown voltage of 40V voltage
the turn-off delay time is 39 ns
NTD5802NT4G Applications
There are a lot of ON Semiconductor
NTD5802NT4G applications of single MOSFETs transistors.
- Micro Solar Inverter
- DC/DC converters
- Power Tools
- Motor Drives and Uninterruptible Power Supples
- Synchronous Rectification
- Battery Protection Circuit
- Telecom 1 Sever Power Supplies
- Industrial Power Supplies
- PFC stages, hard switching PWM stages and resonant switching
- PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
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