IRLR7843PBF

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Mfr.Part #
IRLR7843PBF
Manufacturer
Infineon Technologies
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Datasheet
Download
Description
MOSFET N-CH 30V 161A DPAK
Stock
61,708
In Stock :
61,708

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Manufacturer :
Infineon Technologies
Product Category :
Transistors - FETs, MOSFETs - Single
Series :
HEXFET®
Drive Voltage (Max Rds On,Min Rds On) :
4.5V 10V
Vgs (Max) :
±20V
Package / Case :
TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging :
Tube
FET Type :
N-Channel
Current - Continuous Drain (Id) @ 25°C :
161A Tc
Operating Temperature :
-55°C~175°C TJ
Mounting Type :
Surface Mount
Gate Charge (Qg) (Max) @ Vgs :
50nC @ 4.5V
Published :
2006
Vgs(th) (Max) @ Id :
2.3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds :
4380pF @ 15V
ECCN Code :
EAR99
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Rds On (Max) @ Id, Vgs :
3.3m Ω @ 15A, 10V
Power Dissipation-Max :
140W Tc
Drain to Source Voltage (Vdss) :
30V
RoHS Status :
ROHS3 Compliant
Datasheets
IRLR7843PBF
Introducing Transistors - FETs, MOSFETs - Single Infineon Technologies IRLR7843PBF from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63, Operating Temperature:-55°C~175°C TJ, Mounting Type:Surface Mount, IRLR7843PBF pinout, IRLR7843PBF datasheet PDF, IRLR7843PBF amp .Beyond Transistors - FETs, MOSFETs - Single Infineon Technologies IRLR7843PBF ,we also offer EPC2019, EPC2053, EPC2015C, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies IRLR7843PBF


N-Channel Tube 3.3m Ω @ 15A, 10V ±20V 4380pF @ 15V 50nC @ 4.5V 30V TO-252-3, DPak (2 Leads + Tab), SC-63

IRLR7843PBF   Description


  The P-channel MOSFET  IRLR7843PBF  of the International Rectifier Company adopts advanced technology to achieve a very low on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with extremely efficient and reliable devices for battery and load management. The heat-enhanced large pad lead frame is used in the standard SOT-23 package to produce the smallest HEXFET power MOSFET in the industry. This package, known as Micro3 packaging, is ideal for applications where space on printed circuit boards is scarce. The ultra-thin shape of the Micro3 (< 1.1 mm) makes it easy to adapt to extremely thin application environments, such as portable electronics and PCMCIA cards. Thermal resistance and power consumption are the best.


IRLR7843PBF     Applications


 High Frequency Synchronous Buck

 Converters for Computer Processor Power

 High Frequency Isolated DC-DC

 Converters with Synchronous Rectification

 for Telecom and Industrial Use

 Lead-Free

 

IRLR7843PBF    Features


 Very Low RDS(on) at 4.5V VGS

 Ultra-Low Gate Impedance

 Fully Characterized Avalanche Voltage  and Current


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