IRLR7843PBF

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Mfr.Part #
IRLR7843PBF
Manufacturer
International Rectifier
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Datasheet
Download
Description
HEXFET POWER MOSFET
Stock
61,708
In Stock :
61,708

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Manufacturer :
International Rectifier
Product Category :
Transistors - FETs, MOSFETs - Single
Power Dissipation-Max :
140W Tc
Vgs (Max) :
±20V
Packaging :
Tube
Gate Charge (Qg) (Max) @ Vgs :
50nC @ 4.5V
Operating Temperature :
-55°C~175°C TJ
Input Capacitance (Ciss) (Max) @ Vds :
4380pF @ 15V
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Vgs(th) (Max) @ Id :
2.3V @ 250μA
ECCN Code :
EAR99
Mounting Type :
Surface Mount
Series :
HEXFET®
Package / Case :
TO-252-3, DPak (2 Leads + Tab), SC-63
Current - Continuous Drain (Id) @ 25°C :
161A Tc
Rds On (Max) @ Id, Vgs :
3.3m Ω @ 15A, 10V
Drain to Source Voltage (Vdss) :
30V
Published :
2006
RoHS Status :
ROHS3 Compliant
Drive Voltage (Max Rds On,Min Rds On) :
4.5V 10V
FET Type :
N-Channel
Datasheets
IRLR7843PBF
Introducing Transistors - FETs, MOSFETs - Single International Rectifier IRLR7843PBF from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-55°C~175°C TJ, Mounting Type:Surface Mount, Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63, IRLR7843PBF pinout, IRLR7843PBF datasheet PDF, IRLR7843PBF amp .Beyond Transistors - FETs, MOSFETs - Single International Rectifier IRLR7843PBF ,we also offer EPC2019, EPC2053, EPC2015C, Our vast inventory has you covered. Contact us now for immediate solutions.

International Rectifier IRLR7843PBF


N-Channel Tube 3.3m Ω @ 15A, 10V ±20V 4380pF @ 15V 50nC @ 4.5V 30V TO-252-3, DPak (2 Leads + Tab), SC-63

IRLR7843PBF   Description


  The P-channel MOSFET  IRLR7843PBF  of the International Rectifier Company adopts advanced technology to achieve a very low on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with extremely efficient and reliable devices for battery and load management. The heat-enhanced large pad lead frame is used in the standard SOT-23 package to produce the smallest HEXFET power MOSFET in the industry. This package, known as Micro3 packaging, is ideal for applications where space on printed circuit boards is scarce. The ultra-thin shape of the Micro3 (< 1.1 mm) makes it easy to adapt to extremely thin application environments, such as portable electronics and PCMCIA cards. Thermal resistance and power consumption are the best.


IRLR7843PBF     Applications


 High Frequency Synchronous Buck

 Converters for Computer Processor Power

 High Frequency Isolated DC-DC

 Converters with Synchronous Rectification

 for Telecom and Industrial Use

 Lead-Free

 

IRLR7843PBF    Features


 Very Low RDS(on) at 4.5V VGS

 Ultra-Low Gate Impedance

 Fully Characterized Avalanche Voltage  and Current


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