IRLI530N
- Mfr.Part #
- IRLI530N
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 100V 12A TO220AB FP
- Stock
- 34,677
- In Stock :
- 34,677
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Gate Charge (Qg) (Max) @ Vgs :
- 34nC @ 5V
- JEDEC-95 Code :
- TO-220AB
- Terminal Position :
- Single
- Transistor Element Material :
- SILICON
- Number of Terminations :
- 3
- Input Capacitance (Ciss) (Max) @ Vds :
- 800pF @ 25V
- Number of Elements :
- 1
- DS Breakdown Voltage-Min :
- 100V
- Operating Mode :
- ENHANCEMENT MODE
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-30 Code :
- R-PSFM-T3
- Rds On (Max) @ Id, Vgs :
- 100m Ω @ 9A, 10V
- Drive Voltage (Max Rds On,Min Rds On) :
- 4V 10V
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Avalanche Energy Rating (Eas) :
- 150 mJ
- Drain-source On Resistance-Max :
- 0.12Ohm
- FET Type :
- N-Channel
- Surface Mount :
- No
- Additional Feature :
- AVALANCHE RATED, HIGH RELIABILITY, LOGIC LEVEL COMPATIBLE
- Pulsed Drain Current-Max (IDM) :
- 60A
- RoHS Status :
- Non-RoHS Compliant
- Transistor Application :
- SWITCHING
- Drain to Source Voltage (Vdss) :
- 100V
- Published :
- 1998
- Drain Current-Max (Abs) (ID) :
- 12A
- Power Dissipation-Max :
- 41W Tc
- Operating Temperature :
- -55°C~175°C TJ
- Current - Continuous Drain (Id) @ 25°C :
- 12A Tc
- Case Connection :
- Isolated
- Mounting Type :
- Through Hole
- Vgs (Max) :
- ±16V
- Series :
- HEXFET®
- Packaging :
- Tube
- Package / Case :
- TO-220-3 Full Pack
- Datasheets
- IRLI530N

N-Channel Tube 100m Ω @ 9A, 10V ±16V 800pF @ 25V 34nC @ 5V 100V TO-220-3 Full Pack
IRLI530N Description
The IRLI530NP is a HEXFET? fifth generation single N-channel Power MOSFET utilizing advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design provides an extremely efficient and reliable operation. The package eliminates the need for additional insulating hardware. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heat sink. This isolation is equivalent to using a 100-micron mica barrier. The package is mounted to a heat sink using a single clip or by a single screw fixing.
IRLI530N Features
-
Logic level gate drive
-
Advanced process technology
-
Isolated package
-
Fully avalanche rating
-
Low static drain-to-source ON-resistance
-
Logic level
IRLI530N Applications
-
Commercial
-
Industrial
-
Power Management
-
Induction furnaces
-
Arc furnaces and arc welders
-
Steel rolling mills
-
Large motors with periodic loading
-
Thyristor drives
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