IRLI2910
- Mfr.Part #
- IRLI2910
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-220-3 Full Pack
- Datasheet
- Download
- Description
- MOSFET N-CH 100V 31A TO220AB FP
- Stock
- 18,061
- In Stock :
- 18,061
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Drive Voltage (Max Rds On,Min Rds On) :
- 4V 10V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Rds On (Max) @ Id, Vgs :
- 26m Ω @ 16A, 10V
- Power Dissipation-Max :
- 63W Tc
- Gate Charge (Qg) (Max) @ Vgs :
- 140nC @ 5V
- Number of Terminations :
- 3
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Transistor Element Material :
- SILICON
- Input Capacitance (Ciss) (Max) @ Vds :
- 3700pF @ 25V
- Drain-source On Resistance-Max :
- 0.03Ohm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- No
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Avalanche Energy Rating (Eas) :
- 520 mJ
- Drain to Source Voltage (Vdss) :
- 100V
- Case Connection :
- Isolated
- Vgs (Max) :
- ±16V
- Published :
- 1998
- DS Breakdown Voltage-Min :
- 100V
- Current - Continuous Drain (Id) @ 25°C :
- 31A Tc
- JEDEC-95 Code :
- TO-220AB
- Series :
- HEXFET®
- Drain Current-Max (Abs) (ID) :
- 31A
- JESD-30 Code :
- R-PSFM-T3
- ECCN Code :
- EAR99
- Pulsed Drain Current-Max (IDM) :
- 190A
- Operating Mode :
- ENHANCEMENT MODE
- Transistor Application :
- SWITCHING
- Terminal Position :
- Single
- FET Type :
- N-Channel
- RoHS Status :
- Non-RoHS Compliant
- Mounting Type :
- Through Hole
- Operating Temperature :
- -55°C~175°C TJ
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- Packaging :
- Tube
- Qualification Status :
- Not Qualified
- Number of Elements :
- 1
- Package / Case :
- TO-220-3 Full Pack
- Additional Feature :
- AVALANCHE RATED
- Datasheets
- IRLI2910

N-Channel Tube 26m Ω @ 16A, 10V ±16V 3700pF @ 25V 140nC @ 5V 100V TO-220-3 Full Pack
Description
The IRLI2910 is a 100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package. International Rectifier's Fifth Generation HEXFETs use cutting-edge processing methods to achieve exceptionally low on-resistance per silicon area. This feature offers the designer a highly effective and dependable device for usage in various applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
In commercial and industrial applications, the TO-220 Full Pak eliminates the need for additional insulating gear. The molding material utilized offers thermal solid isolation between the tab and external heat sink and low thermal resistance. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heat sink.
Features
-
Fast Switching
-
High Voltage Isolation = 2.5KVRMS ?
-
Sink to Lead Creepage Dist. = 4.8mm
-
Fully Avalanche Rated
-
Lead-Free
-
Logic ¨CLevel Gate Drive
-
Advanced Process Technology
-
Ultra Low On-Resistance
-
Isolated Package
Applications
-
Switch Mode Power Supplies (SMPS)
-
Power-Over-Ethernet (PoE)
-
Solar inverters
-
Automotive applications
-
Switch, buck and synchronous rectification
-
Uninterruptible Power Supplies (UPS)
-
Small motor control
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