IRF9953
- Mfr.Part #
- IRF9953
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 30V 2.3A 8-SOIC
- Stock
- 25,200
- In Stock :
- 25,200
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Number of Elements :
- 2
- Drain-source On Resistance-Max :
- 0.25Ohm
- Terminal Finish :
- TIN LEAD
- Terminal Form :
- Gull wing
- Vgs(th) (Max) @ Id :
- 1V @ 250μA
- FET Type :
- 2 P-Channel (Dual)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Published :
- 1997
- Qualification Status :
- Not Qualified
- DS Breakdown Voltage-Min :
- 30V
- Surface Mount :
- yes
- Operating Temperature :
- -55°C~150°C TJ
- Gate Charge (Qg) (Max) @ Vgs :
- 12nC @ 10V
- Drain to Source Voltage (Vdss) :
- 30V
- Rds On (Max) @ Id, Vgs :
- 250m Ω @ 1A, 10V
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- ECCN Code :
- EAR99
- Input Capacitance (Ciss) (Max) @ Vds :
- 190pF @ 15V
- Power - Max :
- 2W
- Current - Continuous Drain (Id) @ 25°C :
- 2.3A
- JESD-30 Code :
- R-PDSO-G8
- FET Feature :
- Logic Level Gate
- Transistor Element Material :
- SILICON
- Avalanche Energy Rating (Eas) :
- 57 mJ
- Drain Current-Max (Abs) (ID) :
- 2.3A
- Series :
- HEXFET®
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Mode :
- ENHANCEMENT MODE
- Number of Terminations :
- 8
- JESD-609 Code :
- e0
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Transistor Application :
- SWITCHING
- RoHS Status :
- Non-RoHS Compliant
- Mounting Type :
- Surface Mount
- Additional Feature :
- High Reliability
- Pulsed Drain Current-Max (IDM) :
- 10A
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 245
- Datasheets
- IRF9953

IRF9953 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF9953 Description
The fifth generation HEXFET of the International Rectifier Company adopts advanced technology to achieve a very low on-resistance per silicon, this advantage. Combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, it provides designers with an extremely efficient and reliable device for use in a variety of applications.
The SO-8 has been modified with a custom l ead f rame to enhance properties and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to greatly reduce circuit board space. The package is designed for vapor phase red inner or wave soldering technology.
IRF9953 Features
Planar cell structure for wide SOA
Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100KHz
Industry standard surface-mount power package
IRF9953 Applications
making it an ideal choice for a variety of power applications
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