IRF9395MTRPBF
- Mfr.Part #
- IRF9395MTRPBF
- Manufacturer
- International Rectifier
- Package / Case
- DirectFET™ Isometric MC
- Datasheet
- Download
- Description
- DIRECTFET DUAL P-CHANNEL POWER M
- Stock
- 9,443
- In Stock :
- 9,443
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- Manufacturer :
- International Rectifier
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Terminal Finish :
- Matte Tin (Sn)
- Number of Pins :
- 10
- Mount :
- Surface Mount
- ECCN Code :
- EAR99
- Operating Temperature :
- -40°C~150°C TJ
- Factory Lead Time :
- 17 Weeks
- Gate to Source Voltage (Vgs) :
- 20V
- Operating Mode :
- ENHANCEMENT MODE
- Input Capacitance (Ciss) (Max) @ Vds :
- 3241pF @ 15V
- Series :
- HEXFET®
- Packaging :
- Tape and Reel (TR)
- Turn-Off Delay Time :
- 76 ns
- JESD-30 Code :
- R-XBCC-N6
- Fall Time (Typ) :
- 121 ns
- JESD-609 Code :
- e3
- Max Power Dissipation :
- 2.1W
- Number of Terminations :
- 6
- Published :
- 2007
- Terminal Position :
- BOTTOM
- Transistor Application :
- SWITCHING
- Case Connection :
- DRAIN
- FET Type :
- 2 P-Channel (Dual)
- Gate Charge (Qg) (Max) @ Vgs :
- 64nC @ 10V
- Transistor Element Material :
- SILICON
- Rds On (Max) @ Id, Vgs :
- 7m Ω @ 14A, 10V
- Number of Elements :
- 1
- Mounting Type :
- Surface Mount
- Drain-source On Resistance-Max :
- 0.007Ohm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Rise Time :
- 142ns
- Drain Current-Max (Abs) (ID) :
- 75A
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- RoHS Status :
- ROHS3 Compliant
- Turn On Delay Time :
- 19 ns
- Element Configuration :
- Dual
- Vgs(th) (Max) @ Id :
- 2.4V @ 50μA
- Drain to Source Voltage (Vdss) :
- 30V
- Continuous Drain Current (ID) :
- 14A
- Drain to Source Breakdown Voltage :
- -30V
- Power Dissipation :
- 2.1W
- Radiation Hardening :
- No
- Package / Case :
- DirectFET™ Isometric MC
- FET Feature :
- Logic Level Gate
- Datasheets
- IRF9395MTRPBF

IRF9395MTRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF9395MTRPBF Description
IRF9395MTRPbF combines the latest HEXFET P-channel power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-resistance in a 0.6 mm package. The DirectFET package is compatible with existing layout geometry used in power applications, printed circuit board assembly equipment and gas phase, infrared or convection soldering technologies, as long as the manufacturing method and process instructions in the AN-1035 application instructions are followed. The DirectFET package allows double-sided cooling to maximize heat transfer in the power system, increasing the previously optimal thermal resistance by 80 per cent.
IRF9395MTRPBF Applications
·Isolation Switch for Input Power or Battery Application
IRF9395MTRPBF Features
Environmentaly Friendly Product
RoHs Compliant Containing no Lead no Bromide and no Halogen
Dual Common-Drain P-Channel MOSFETs Provides High Level of Integration and Very Low RDS(on)
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