IRF6894MTRPBF
- Mfr.Part #
- IRF6894MTRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- DirectFET™ Isometric MX
- Datasheet
- Download
- Description
- IRF6894 - 12V-300V N-CHANNEL POW
- Stock
- 1,000
- In Stock :
- 1,000
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- FET Type :
- N-Channel
- Resistance :
- 1.3MOhm
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Packaging :
- Tape and Reel (TR)
- Turn On Delay Time :
- 16 ns
- Transistor Application :
- SWITCHING
- Turn-Off Delay Time :
- 20 ns
- Factory Lead Time :
- 13 Weeks
- Transistor Element Material :
- SILICON
- Radiation Hardening :
- No
- FET Feature :
- Schottky Diode (Body)
- Vgs (Max) :
- ±16V
- ECCN Code :
- EAR99
- Package / Case :
- DirectFET™ Isometric MX
- Vgs(th) (Max) @ Id :
- 2.1V @ 100μA
- Number of Terminations :
- 3
- Rise Time :
- 42ns
- Gate to Source Voltage (Vgs) :
- 16V
- Gate Charge (Qg) (Max) @ Vgs :
- 39nC @ 4.5V
- Fall Time (Typ) :
- 14 ns
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Power Dissipation-Max :
- 2.1W Ta 54W Tc
- Published :
- 2004
- Power Dissipation :
- 54W
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- JESD-609 Code :
- e3
- Drain to Source Breakdown Voltage :
- 25V
- Rds On (Max) @ Id, Vgs :
- 1.3m Ω @ 33A, 10V
- Current - Continuous Drain (Id) @ 25°C :
- 32A Ta 160A Tc
- Case Connection :
- DRAIN
- Number of Elements :
- 1
- Drain Current-Max (Abs) (ID) :
- 33A
- Pulsed Drain Current-Max (IDM) :
- 260A
- Operating Temperature :
- -40°C~150°C TJ
- Mount :
- Surface Mount
- Lead Free :
- Lead Free
- RoHS Status :
- ROHS3 Compliant
- Operating Mode :
- ENHANCEMENT MODE
- Terminal Position :
- BOTTOM
- Continuous Drain Current (ID) :
- 32A
- Series :
- HEXFET®
- Terminal Finish :
- Matte Tin (Sn)
- JESD-30 Code :
- R-XBCC-N3
- Number of Pins :
- 7
- Input Capacitance (Ciss) (Max) @ Vds :
- 4160pF @ 13V
- Datasheets
- IRF6894MTRPBF

N-Channel Tape & Reel (TR) 1.3m Ω @ 33A, 10V ±16V 4160pF @ 13V 39nC @ 4.5V DirectFET™ Isometric MX
IRF6894MTRPBF Description
IRF6894MPbF combines the latest HEXFET power MOSFET silicon technology with advanced DirectFET silicon packaging to achieve the lowest on-resistance in a SO-8 package with a package area of only 0.7 mm. The DirectFETPCB package is compatible with existing layout geometry used in power applications, diamond assembly equipment and gas phase, infrared or convection welding technologies. Follow the application notes on manufacturing methods and processes AN-1035. The DirectFET seal package allows double-sided cooling to maximize heat transfer in the power system, increasing the previous optimal thermal resistance by 80 per cent. The IRF6894MPbF balances industry-leading on-resistance while minimizing gate charge while reducing on-and switching losses. This part includes an integrated Schottky diode, which can reduce the Qrr of the bulk drain diode and further reduce the loss in the synchronous buck circuit. The reduced loss makes it ideal for high-frequency / high-efficiency DC-DC converters to power high-current loads, such as the latest generation of microprocessors. IRF6894MPbF optimizes the key parameters in the Sync FET socket of the synchronous buck converter.
IRF6894MTRPBF Features
RoHs Compliant Containing No Lead and Bromide ?
Integrated Monolithic Schottky Diode
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible ?
Low Package Inductance
Optimized for High Frequency Switching
Ideal for CPU Core DC-DC Converters
Optimized for Sync. FET socket of Sync. Buck Converter
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques ?
100% Rg tested
Footprint compatible to DirectFET
IRF6894MTRPBF Applications
high-frequency / high-efficiency DC-DC converters
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