IRF6721STR1PBF
- Mfr.Part #
- IRF6721STR1PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- DirectFET™ Isometric SQ
- Datasheet
- Download
- Description
- MOSFET N-CH 30V 14A DIRECTFET
- Stock
- 16,911
- In Stock :
- 16,911
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Width :
- 3.95mm
- Supplier Device Package :
- DIRECTFET™ SQ
- Continuous Drain Current (ID) :
- 14A
- Drain to Source Resistance :
- 10.9mOhm
- Input Capacitance (Ciss) (Max) @ Vds :
- 1430pF @ 15V
- Rds On Max :
- 7.3 mΩ
- Gate to Source Voltage (Vgs) :
- 20V
- Max Operating Temperature :
- 150°C
- Published :
- 2007
- FET Type :
- N-Channel
- Length :
- 4.826mm
- Operating Temperature :
- -40°C~150°C TJ
- Drain to Source Voltage (Vdss) :
- 30V
- Rds On (Max) @ Id, Vgs :
- 7.3mOhm @ 14A, 10V
- Nominal Vgs :
- 1.9 V
- Current - Continuous Drain (Id) @ 25°C :
- 14A Ta 60A Tc
- Radiation Hardening :
- No
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Height :
- 508μm
- Series :
- HEXFET®
- RoHS Status :
- RoHS Compliant
- Power Dissipation :
- 2.2W
- Fall Time (Typ) :
- 5.3 ns
- Threshold Voltage :
- 1.9V
- Package / Case :
- DirectFET™ Isometric SQ
- Input Capacitance :
- 1.43nF
- Recovery Time :
- 26 ns
- Packaging :
- Tape and Reel (TR)
- Rise Time :
- 8.9ns
- Mounting Type :
- Surface Mount
- REACH SVHC :
- No SVHC
- Turn On Delay Time :
- 7.8 ns
- Min Operating Temperature :
- -40°C
- Drain to Source Breakdown Voltage :
- 30V
- Mount :
- Surface Mount
- Power Dissipation-Max :
- 2.2W Ta 42W Tc
- Vgs (Max) :
- ±20V
- Number of Elements :
- 1
- Vgs(th) (Max) @ Id :
- 2.4V @ 25μA
- Turn-Off Delay Time :
- 9.3 ns
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Gate Charge (Qg) (Max) @ Vgs :
- 17nC @ 4.5V
- Number of Pins :
- 6
- Datasheets
- IRF6721STR1PBF

N-Channel Tape & Reel (TR) 7.3mOhm @ 14A, 10V ±20V 1430pF @ 15V 17nC @ 4.5V 30V DirectFET™ Isometric SQ
IRF6721STR1PBF Description
IRF6721SPbF combines the latest HEXFET power MOSFET silicon technology with advanced DirectFET silicon packaging to achieve the lowest on-resistance in an 8 micron package with a form factor of only 0.7 mm. When following application instructions AN- 1035, the DirectFET package is compatible with existing layout geometry used in power applications, printed circuit board assembly equipment and gas phase, infrared or convection welding technologies. DirectFET components allow double-sided cooling to maximize heat transfer in the power system. Improved the previous best heat resistance by 80%.
The IRF6721SPbF balances low resistance and low charge as well as ultra-low package inductors, thereby reducing turn-on and switching losses. The reduced total loss makes the product ideal for high-efficiency DC-DC converters that power the latest generation of processors running at higher frequencies. IRF6721SPbF optimizes the key parameters in the synchronous buck operation of 12V bus converters (including RDS and gate charge) to minimize loss.
IRF6721STR1PBF Features
RoHS Compliant and Halogen Free
Low Profile(<0.7mm)
Dual Sided Cooling Compatible
Ultra Low PackageInductance
Optimized for High Frequency Switching
Ideal for CPU Core DC-DC Converters
Optimized for Control FET application
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques
100%Rg tested
IRF6721STR1PBF Applications
high-efficiency DC-DC converters
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