IRF6718L2TR1PBF
- Mfr.Part #
- IRF6718L2TR1PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- DirectFET™ Isometric L6
- Datasheet
- Download
- Description
- MOSFET N-CH 25V 61A DIRECTFET
- Stock
- 5,325
- In Stock :
- 5,325
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Power Dissipation-Max :
- 4.3W Ta 83W Tc
- FET Type :
- N-Channel
- Width :
- 7.1mm
- Input Capacitance (Ciss) (Max) @ Vds :
- 6500pF @ 13V
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Package / Case :
- DirectFET™ Isometric L6
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- REACH SVHC :
- No SVHC
- Radiation Hardening :
- No
- Resistance :
- 500kOhm
- Vgs (Max) :
- ±20V
- Drain to Source Voltage (Vdss) :
- 25V
- Nominal Vgs :
- 1.9 V
- Packaging :
- Tape and Reel (TR)
- Element Configuration :
- Single
- Max Operating Temperature :
- 175°C
- Height :
- 508μm
- Turn-Off Delay Time :
- 47 ns
- Rds On (Max) @ Id, Vgs :
- 0.7mOhm @ 61A, 10V
- Drain to Source Resistance :
- 700μOhm
- Rds On Max :
- 700 μΩ
- Min Operating Temperature :
- -55°C
- Termination :
- SMD/SMT
- Gate to Source Voltage (Vgs) :
- 20V
- Series :
- HEXFET®
- Recovery Time :
- 59 ns
- Drain to Source Breakdown Voltage :
- 25V
- Rise Time :
- 140ns
- Turn On Delay Time :
- 67 ns
- Length :
- 9.144mm
- Gate Charge (Qg) (Max) @ Vgs :
- 96nC @ 4.5V
- Threshold Voltage :
- 1.9V
- Number of Pins :
- 13
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Published :
- 2011
- Supplier Device Package :
- DIRECTFET L6
- Input Capacitance :
- 6.5nF
- Operating Temperature :
- -55°C~175°C TJ
- Dual Supply Voltage :
- 25V
- Current - Continuous Drain (Id) @ 25°C :
- 61A Ta 270A Tc
- Fall Time (Typ) :
- 53 ns
- RoHS Status :
- RoHS Compliant
- Continuous Drain Current (ID) :
- 61A
- Vgs(th) (Max) @ Id :
- 2.35V @ 150μA
- Mount :
- Surface Mount
- Power Dissipation :
- 4.3W
- Datasheets
- IRF6718L2TR1PBF

N-Channel Tape & Reel (TR) 0.7mOhm @ 61A, 10V ±20V 6500pF @ 13V 96nC @ 4.5V 25V DirectFET™ Isometric L6
IRF6718L2TR1PBF Description
The IRF6718L2TRPbF combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET? packaging to achieve the lowest on-state resistance in a package that has the footprint of a D-peak. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, vapor phase, and infra-red or convection soldering techniques when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual-sided cooling to maximize thermal transfer in power systems.
IRF6718L2TR1PBF Features
RoHS Compliant Containing No Lead and Bromide
Dual-Sided Cooling Compatible
Ultra-Low Package Inductance
Very Low RDS(ON) for Reduced Conduction Losses
Optimized for Active O-Ring / Efuse Applications
Compatible with existing Surface Mount Techniques
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