IRF6713STRPBF
- Mfr.Part #
- IRF6713STRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- DirectFET™ Isometric SQ
- Datasheet
- Download
- Description
- MOSFET N-CH 25V 22A DIRECTFET
- Stock
- 11,395
- In Stock :
- 11,395
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Drain-source On Resistance-Max :
- 0.003Ohm
- Turn On Delay Time :
- 12 ns
- Mount :
- Surface Mount
- Case Connection :
- DRAIN
- Rise Time :
- 13ns
- Current - Continuous Drain (Id) @ 25°C :
- 22A Ta 95A Tc
- Number of Terminations :
- 2
- Fall Time (Typ) :
- 6 ns
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Gate Charge (Qg) (Max) @ Vgs :
- 32nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds :
- 2880pF @ 13V
- Factory Lead Time :
- 15 Weeks
- Rds On (Max) @ Id, Vgs :
- 3m Ω @ 22A, 10V
- RoHS Status :
- RoHS Compliant
- Vgs (Max) :
- ±20V
- Gate to Source Voltage (Vgs) :
- 20V
- Packaging :
- Tape and Reel (TR)
- Vgs(th) (Max) @ Id :
- 2.4V @ 50μA
- Number of Elements :
- 1
- Series :
- HEXFET®
- Number of Pins :
- 5
- Power Dissipation :
- 42W
- Contact Plating :
- Copper, Silver, Tin
- Avalanche Energy Rating (Eas) :
- 34 mJ
- Length :
- 4.826mm
- Height :
- 506μm
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Turn-Off Delay Time :
- 9.2 ns
- FET Type :
- N-Channel
- Operating Temperature :
- -40°C~150°C TJ
- Radiation Hardening :
- No
- Published :
- 2008
- Drain to Source Breakdown Voltage :
- 25V
- Terminal Position :
- BOTTOM
- Mounting Type :
- Surface Mount
- Operating Mode :
- ENHANCEMENT MODE
- Power Dissipation-Max :
- 2.2W Ta 42W Tc
- Transistor Application :
- SWITCHING
- JESD-30 Code :
- R-XBCC-N2
- Continuous Drain Current (ID) :
- 22A
- Transistor Element Material :
- SILICON
- ECCN Code :
- EAR99
- Package / Case :
- DirectFET™ Isometric SQ
- Width :
- 3.95mm
- Datasheets
- IRF6713STRPBF

N-Channel Tape & Reel (TR) 3m Ω @ 22A, 10V ±20V 2880pF @ 13V 32nC @ 4.5V DirectFET™ Isometric SQ
IRF6713STRPBF Overview
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 34 mJ.The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 2880pF @ 13V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 22A. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=25V. And this device has 25V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 9.2 ns.Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 12 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
IRF6713STRPBF Features
the avalanche energy rating (Eas) is 34 mJ
a continuous drain current (ID) of 22A
a drain-to-source breakdown voltage of 25V voltage
the turn-off delay time is 9.2 ns
IRF6713STRPBF Applications
There are a lot of Infineon Technologies
IRF6713STRPBF applications of single MOSFETs transistors.
- LCD/LED TV
- Consumer Appliances
- Lighting
- Uninterruptible Power Supply
- AC-DC Power Supply
- Synchronous Rectification for ATX 1 Server I Telecom PSU
- Motor drives and Uninterruptible Power Supplies
- Micro Solar Inverter
- DC/DC converters
- Power Tools
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