IRF6635
- Mfr.Part #
- IRF6635
- Manufacturer
- Infineon Technologies
- Package / Case
- DirectFET™ Isometric MX
- Datasheet
- Download
- Description
- MOSFET N-CH 30V 32A DIRECTFET
- Stock
- 41,112
- In Stock :
- 41,112
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Drain to Source Voltage (Vdss) :
- 30V
- Published :
- 2005
- FET Type :
- N-Channel
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- Rds On (Max) @ Id, Vgs :
- 1.8m Ω @ 32A, 10V
- Terminal Finish :
- Silver/Nickel (Ag/Ni)
- Package / Case :
- DirectFET™ Isometric MX
- Vgs (Max) :
- ±20V
- Current - Continuous Drain (Id) @ 25°C :
- 32A Ta 180A Tc
- JESD-30 Code :
- R-XBCC-N3
- Operating Temperature :
- -40°C~150°C TJ
- Number of Elements :
- 1
- Power Dissipation-Max :
- 2.8W Ta 89W Tc
- Terminal Position :
- BOTTOM
- DS Breakdown Voltage-Min :
- 30V
- Gate Charge (Qg) (Max) @ Vgs :
- 71nC @ 4.5V
- Packaging :
- Tape and Reel (TR)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Input Capacitance (Ciss) (Max) @ Vds :
- 5970pF @ 15V
- Drain-source On Resistance-Max :
- 0.0018Ohm
- Avalanche Energy Rating (Eas) :
- 200 mJ
- Drain Current-Max (Abs) (ID) :
- 32A
- Case Connection :
- DRAIN
- Vgs(th) (Max) @ Id :
- 2.35V @ 250μA
- Series :
- HEXFET®
- JESD-609 Code :
- e4
- Terminal Form :
- NO LEAD
- Transistor Element Material :
- SILICON
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Transistor Application :
- SWITCHING
- Pulsed Drain Current-Max (IDM) :
- 250A
- Number of Terminations :
- 3
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Mode :
- ENHANCEMENT MODE
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- ECCN Code :
- EAR99
- Datasheets
- IRF6635

N-Channel Tape & Reel (TR) 1.8m Ω @ 32A, 10V ±20V 5970pF @ 15V 71nC @ 4.5V 30V DirectFET™ Isometric MX
IRF6635 Description
The IRF6635 combines the latest HEXFET@ Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only a 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor-phase, infra-red, or convection soldering techniques. The DirectFET package allows dual-sided cooling to maximize thermal transfer in power systems, improving the previous best thermal resistance by 80%。
IRF6635 Features
-
RoHS compliant containing no lead or bromide
-
Low Profile (<0.7 mm)
-
Dual Sided Cooling Compatible
-
Ultra-Low Package Inductance
-
Optimized for High-Frequency Switching
-
ideal for CPU Core DC-DC Converters
-
Optimized for SyncFET socket of Sync. Buck Converter
-
Low Conduction and Switching Losses
-
Compatible with existing Surface Mount Techniques
IRF6635 Applications
-
eFuse
-
HotSwap
-
MultiPhase SyncFET
-
ORing
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