IRF6603

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Mfr.Part #
IRF6603
Manufacturer
Infineon Technologies
Package / Case
DirectFET™ Isometric MT
Datasheet
Download
Description
MOSFET N-CH 30V 27A DIRECTFET
Stock
6,974
In Stock :
6,974

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Manufacturer :
Infineon Technologies
Product Category :
Transistors - FETs, MOSFETs - Single
Mounting Type :
Surface Mount
FET Type :
N-Channel
Packaging :
Tape and Reel (TR)
Package / Case :
DirectFET™ Isometric MT
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Drain to Source Voltage (Vdss) :
30V
Series :
HEXFET®
Drive Voltage (Max Rds On,Min Rds On) :
4.5V 10V
Power Dissipation-Max :
3.6W Ta 42W Tc
Gate Charge (Qg) (Max) @ Vgs :
72nC @ 4.5V
Vgs(th) (Max) @ Id :
2.5V @ 250μA
RoHS Status :
Non-RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds :
6590pF @ 15V
Current - Continuous Drain (Id) @ 25°C :
27A Ta 92A Tc
Published :
2005
Rds On (Max) @ Id, Vgs :
3.4m Ω @ 25A, 10V
Vgs (Max) :
+20V, -12V
Operating Temperature :
-40°C~150°C TJ
Datasheets
IRF6603
Introducing Transistors - FETs, MOSFETs - Single Infineon Technologies IRF6603 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:DirectFET™ Isometric MT, Operating Temperature:-40°C~150°C TJ, IRF6603 pinout, IRF6603 datasheet PDF, IRF6603 amp .Beyond Transistors - FETs, MOSFETs - Single Infineon Technologies IRF6603 ,we also offer EPC2019, EPC2053, EPC2015C, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies IRF6603


N-Channel Tape & Reel (TR) 3.4m Ω @ 25A, 10V +20V, -12V 6590pF @ 15V 72nC @ 4.5V 30V DirectFET™ Isometric MT

IRF6603 Description


The IRF6603 combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFET? packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only a 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapour phase, and infra-red or convection soldering techniques. The DirectFET package allows dual-sided cooling to maximize thermal transfer in power systems, IMPROVING the previous best thermal resistance by 80%.



IRF6603 Features


  • Application-Specific MOSFETs

  • Ideal for CPU Core DC-DC Converters

  • Low Conduction Losses

  • High Cdv/dt Immunity

  • Low Profile (<0.7 mm)

  • Dual-Sided Cooling Compatible

  • Compatible with existing Surface Mount Techniques



IRF6603 Applications


  • High-efficiency DC-DC converters


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