BSC13DN30NSFDATMA1
- Mfr.Part #
- BSC13DN30NSFDATMA1
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-PowerTDFN
- Datasheet
- Download
- Description
- MOSFET N-CH 300V 16A TDSON-8-1
- Stock
- 27,574
- In Stock :
- 27,574
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Terminal Position :
- Dual
- Current - Continuous Drain (Id) @ 25°C :
- 16A Tc
- Series :
- OptiMOS™
- Case Connection :
- DRAIN
- Input Capacitance (Ciss) (Max) @ Vds :
- 2450pF @ 150V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Vgs(th) (Max) @ Id :
- 4V @ 90µA
- Drain Current-Max (Abs) (ID) :
- 16A
- Number of Terminations :
- 5
- Published :
- 2013
- Vgs (Max) :
- ±20V
- RoHS Status :
- ROHS3 Compliant
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Transistor Element Material :
- SILICON
- ECCN Code :
- EAR99
- Operating Mode :
- ENHANCEMENT MODE
- Terminal Form :
- Flat
- Package / Case :
- 8-PowerTDFN
- Pulsed Drain Current-Max (IDM) :
- 64A
- Drain-source On Resistance-Max :
- 0.13Ohm
- Terminal Finish :
- Tin (Sn)
- DS Breakdown Voltage-Min :
- 300V
- Power Dissipation-Max :
- 150W Tc
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- FET Type :
- N-Channel
- Avalanche Energy Rating (Eas) :
- 56 mJ
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Transistor Application :
- SWITCHING
- Packaging :
- Tape and Reel (TR)
- Drain to Source Voltage (Vdss) :
- 300V
- Number of Elements :
- 1
- Mounting Type :
- Surface Mount
- Reach Compliance Code :
- not_compliant
- Operating Temperature :
- -55°C~175°C TJ
- Factory Lead Time :
- 26 Weeks
- Rds On (Max) @ Id, Vgs :
- 130m Ω @ 16A, 10V
- JESD-30 Code :
- R-PDSO-F5
- JESD-609 Code :
- e3
- Gate Charge (Qg) (Max) @ Vgs :
- 30nC @ 10V
- Datasheets
- BSC13DN30NSFDATMA1

N-Channel Tape & Reel (TR) 130m Ω @ 16A, 10V ±20V 2450pF @ 150V 30nC @ 10V 300V 8-PowerTDFN
BSC13DN30NSFDATMA1 Description
The BSC13DN30NSFDATMA1 is a MICRO-8 device with a 0.7 mm profile that combines the latest HEXFET? Power MOSFET Silicon technology with revolutionary DirectFETTM packaging to deliver the lowest on-state resistance in a MICRO-8 device. When application note AN-1035 addressing manufacturing processes and procedures is followed, the DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques.
BSC13DN30NSFDATMA1 Features
?Normal level, N-channel
?It's rated at 175 degrees Celsius.
?Excellent x /?os(on)product (FOM) gate charge
?On-resistanee Rds(oo) are quite low.
?Lead plating free of pb; RoHS compliance
?Qualified for the target application (according to JEDEC1)
?According to IEC61249-2-21, it is halogen-free.
?Perfect for synchronous rectification and high-frequency switching
BSC13DN30NSFDATMA1 Applications
Switching applications
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