FDMS3669S
- Mfr.Part #
- FDMS3669S
- Manufacturer
- onsemi
- Package / Case
- 8-PowerTDFN
- Datasheet
- Download
- Description
- MOSFET 2N-CH 30V 13A/18A POWER56
- Stock
- 2,727
- In Stock :
- 2,727
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Packaging :
- Tape and Reel (TR)
- FET Type :
- 2 N-Channel (Dual) Asymmetrical
- JESD-609 Code :
- e3
- Feedback Cap-Max (Crss) :
- 55 pF
- FET Feature :
- Logic Level Gate
- Mount :
- Surface Mount
- Current - Continuous Drain (Id) @ 25°C :
- 13A 18A
- Drain to Source Breakdown Voltage :
- 30V
- Rise Time :
- 3ns
- Continuous Drain Current (ID) :
- 60A
- Fall Time (Typ) :
- 3 ns
- Lifecycle Status :
- ACTIVE (Last Updated: 3 days ago)
- Drain Current-Max (Abs) (ID) :
- 13A
- Transistor Element Material :
- SILICON
- ECCN Code :
- EAR99
- JESD-30 Code :
- R-PDSO-F6
- Gate Charge (Qg) (Max) @ Vgs :
- 24nC @ 10V
- Transistor Application :
- SWITCHING
- Terminal Form :
- Flat
- RoHS Status :
- ROHS3 Compliant
- Series :
- PowerTrench®
- Height :
- 1.1mm
- Terminal Finish :
- Tin (Sn)
- Package / Case :
- 8-PowerTDFN
- Weight :
- 171mg
- Drain-source On Resistance-Max :
- 0.01Ohm
- Pbfree Code :
- yes
- Power - Max :
- 1W
- Number of Elements :
- 2
- Number of Terminations :
- 6
- Number of Pins :
- 8
- Length :
- 5mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Mode :
- ENHANCEMENT MODE
- Case Connection :
- DRAIN SOURCE
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Max Power Dissipation :
- 2.5W
- Turn-Off Delay Time :
- 24 ns
- Vgs(th) (Max) @ Id :
- 2.7V @ 250μA
- Published :
- 2009
- Rds On (Max) @ Id, Vgs :
- 10m Ω @ 13A, 10V
- Radiation Hardening :
- No
- Width :
- 5.9mm
- Input Capacitance (Ciss) (Max) @ Vds :
- 1605pF @ 15V
- Factory Lead Time :
- 13 Weeks
- Operating Temperature :
- -55°C~150°C TJ
- Gate to Source Voltage (Vgs) :
- 20V
- Mounting Type :
- Surface Mount
- Datasheets
- FDMS3669S

FDMS3669S datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available at
FDMS3669S Description
In a twin PQFN packaging, this device has two specialized N-Channel MOSFETs. To make synchronous buck converter placement and routing simple, the switch node has been internally connected. To offer maximum power efficiency, the control MOSFET (Q1) and synchronous SyncFETTM (Q2) have been created.
FDMS3669S Features
-
Maximum rDS(on) at VGS = 10 V, ID = 18 A is 5 m.
-
Max rDS(on) is 5.2 m at 4.5 V and 17 A.
-
Shorter rise/fall times due to low inductance packing reduce switching losses.
-
The best architecture for lower circuit inductance and less switch node ringing is made possible by MOSFET integration.
-
Conforms to RoHS
FDMS3669S Applications
-
Computing
-
Communications
-
Point of Load for All Purposes
-
Laptop VCORE
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