BSC010NE2LSATMA1

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Mfr.Part #
BSC010NE2LSATMA1
Manufacturer
Infineon Technologies
Package / Case
8-PowerTDFN
Datasheet
Download
Description
MOSFET N-CH 25V 39A/100A TDSON
Stock
149,676
In Stock :
149,676

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Manufacturer :
Infineon Technologies
Product Category :
Transistors - FETs, MOSFETs - Single
Gate to Source Voltage (Vgs) :
20V
Power Dissipation :
96W
Gate Charge (Qg) (Max) @ Vgs :
64nC @ 10V
Drive Voltage (Max Rds On,Min Rds On) :
4.5V 10V
Current - Continuous Drain (Id) @ 25°C :
39A Ta 100A Tc
Power Dissipation-Max :
2.5W Ta 96W Tc
Number of Pins :
8
RoHS Status :
ROHS3 Compliant
Rise Time :
6ns
Number of Elements :
1
Series :
OptiMOS™
Input Capacitance (Ciss) (Max) @ Vds :
4700pF @ 12V
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mount :
Surface Mount
Published :
2012
Package / Case :
8-PowerTDFN
Supplier Device Package :
PG-TDSON-8-7
Continuous Drain Current (ID) :
39A
Rds On (Max) @ Id, Vgs :
1mOhm @ 30A, 10V
FET Type :
N-Channel
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Min Operating Temperature :
-55°C
Vgs (Max) :
±20V
Vgs(th) (Max) @ Id :
2V @ 250μA
Contact Plating :
Tin
Operating Temperature :
-55°C~150°C TJ
Drain to Source Resistance :
800μOhm
Factory Lead Time :
26 Weeks
Max Operating Temperature :
150°C
Drain to Source Voltage (Vdss) :
25V
Datasheets
BSC010NE2LSATMA1
Introducing Transistors - FETs, MOSFETs - Single Infineon Technologies BSC010NE2LSATMA1 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:8, Package / Case:8-PowerTDFN, Mounting Type:Surface Mount, Operating Temperature:-55°C~150°C TJ, BSC010NE2LSATMA1 pinout, BSC010NE2LSATMA1 datasheet PDF, BSC010NE2LSATMA1 amp .Beyond Transistors - FETs, MOSFETs - Single Infineon Technologies BSC010NE2LSATMA1 ,we also offer EPC2019, EPC2053, EPC2015C, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies BSC010NE2LSATMA1


N-Channel Tape & Reel (TR) 1mOhm @ 30A, 10V ±20V 4700pF @ 12V 64nC @ 10V 25V 8-PowerTDFN

BSC010NE2LSATMA1 Description


The BSC010NE2LSATMA1 creates a SO-8-sized footprint and 0.7 mm profile package with the lowest on-state resistance possible by fusing the most advanced HEXFET? Power MOSFET Silicon technology with cutting-edge DirectFETTM packaging. The DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly machinery, and vapor phase, infrared, or convection soldering techniques when application note AN-1035 outlining the manufacturing processes and methods is followed. The two-sided cooling of the DirectFET package reduces thermal resistance by 80% over the previous best while increasing thermal transfer in power systems.



BSC010NE2LSATMA1 Features


?High-performance Buck converter optimized


?Very low on-resistance at Vgs=4.5 V


100% of avalanches were tested


Excellent heat resistance


N'cha nnel


?JEDEC1-qualified for the intended applications


?Pb-free lead plating; complies with RoHS


?In accordance with IEC61249-2-21, halogen-free



BSC010NE2LSATMA1 Applications


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