BSC010NE2LSATMA1
- Mfr.Part #
- BSC010NE2LSATMA1
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-PowerTDFN
- Datasheet
- Download
- Description
- MOSFET N-CH 25V 39A/100A TDSON
- Stock
- 149,676
- In Stock :
- 149,676
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Gate to Source Voltage (Vgs) :
- 20V
- Power Dissipation :
- 96W
- Gate Charge (Qg) (Max) @ Vgs :
- 64nC @ 10V
- Drive Voltage (Max Rds On,Min Rds On) :
- 4.5V 10V
- Current - Continuous Drain (Id) @ 25°C :
- 39A Ta 100A Tc
- Power Dissipation-Max :
- 2.5W Ta 96W Tc
- Number of Pins :
- 8
- RoHS Status :
- ROHS3 Compliant
- Rise Time :
- 6ns
- Number of Elements :
- 1
- Series :
- OptiMOS™
- Input Capacitance (Ciss) (Max) @ Vds :
- 4700pF @ 12V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mount :
- Surface Mount
- Published :
- 2012
- Package / Case :
- 8-PowerTDFN
- Supplier Device Package :
- PG-TDSON-8-7
- Continuous Drain Current (ID) :
- 39A
- Rds On (Max) @ Id, Vgs :
- 1mOhm @ 30A, 10V
- FET Type :
- N-Channel
- Packaging :
- Tape and Reel (TR)
- Mounting Type :
- Surface Mount
- Min Operating Temperature :
- -55°C
- Vgs (Max) :
- ±20V
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- Contact Plating :
- Tin
- Operating Temperature :
- -55°C~150°C TJ
- Drain to Source Resistance :
- 800μOhm
- Factory Lead Time :
- 26 Weeks
- Max Operating Temperature :
- 150°C
- Drain to Source Voltage (Vdss) :
- 25V
- Datasheets
- BSC010NE2LSATMA1

N-Channel Tape & Reel (TR) 1mOhm @ 30A, 10V ±20V 4700pF @ 12V 64nC @ 10V 25V 8-PowerTDFN
BSC010NE2LSATMA1 Description
The BSC010NE2LSATMA1 creates a SO-8-sized footprint and 0.7 mm profile package with the lowest on-state resistance possible by fusing the most advanced HEXFET? Power MOSFET Silicon technology with cutting-edge DirectFETTM packaging. The DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly machinery, and vapor phase, infrared, or convection soldering techniques when application note AN-1035 outlining the manufacturing processes and methods is followed. The two-sided cooling of the DirectFET package reduces thermal resistance by 80% over the previous best while increasing thermal transfer in power systems.
BSC010NE2LSATMA1 Features
?High-performance Buck converter optimized
?Very low on-resistance at Vgs=4.5 V
100% of avalanches were tested
Excellent heat resistance
N'cha nnel
?JEDEC1-qualified for the intended applications
?Pb-free lead plating; complies with RoHS
?In accordance with IEC61249-2-21, halogen-free
BSC010NE2LSATMA1 Applications
Switching applications
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