XCV300E-8FG456C
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- Mfr.Part #
- XCV300E-8FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 5,304
- In Stock ：
- 5,304
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Radiation Hardening :
- No
- Series :
- Virtex®-E
- Number of Outputs :
- 312
- Clock Frequency :
- 416MHz
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 1.71V~1.89V
- Number of Gates :
- 411955
- Number of Logic Elements/Cells :
- 6912
- Peak Reflow Temperature (Cel) :
- 225
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 456-BBGA
- Number of Pins :
- 456
- Number of I/O :
- 312
- Number of Terminations :
- 456
- Speed Grade :
- 8
- Length :
- 23mm
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Width :
- 23mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mount :
- Surface Mount
- Base Part Number :
- XCV300E
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 1.8V
- ECCN Code :
- 3A991.D
- Operating Temperature :
- 0°C~85°C TJ
- RAM Size :
- 16kB
- Lead Free :
- Contains Lead
- Packaging :
- Tray
- Number of LABs/CLBs :
- 1536
- Terminal Form :
- Ball
- Pbfree Code :
- No
- Published :
- 1999
- Height Seated (Max) :
- 2.6mm
- Supply Voltage :
- 1.8V
- Combinatorial Delay of a CLB-Max :
- 0.4 ns
- Pin Count :
- 456
- Total RAM Bits :
- 131072
- Datasheets
- XCV300E-8FG456C
FPGAs AMD Xilinx XCV300E-8FG456C Overview
The AMD Xilinx XCV300E-8FG456C is a highly capable FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital applications. This device is part of the robust Xilinx family, known for its flexibility and performance in programmable logic solutions. With a compact 456-pin FBGA (Fine-pitch Ball Grid Array) package, the XCV300E-8FG456C offers a substantial I/O capacity of 312, making it ideally suited for high-density integration into custom hardware environments. This product is engineered to provide a versatile foundation for developing complex digital circuits, ensuring that it can be tailored to support a wide range of functionalities and applications.
XCV300E-8FG456C Features
The XCV300E-8FG456C boasts an array of features that make it a powerful choice for system designers. Key features include its substantial I/O interface with 312 programmable I/O pins, enabling extensive connectivity options. The FPGA operates efficiently with an 8ns clock delay, facilitating rapid data processing and timely task execution. Its FBGA packaging not only helps in reducing the physical space requirements but also enhances the thermal management of the device. Additionally, this FPGA supports various logic optimizations and is compatible with multiple design environments, making it versatile for various programming needs.
XCV300E-8FG456C Applications
- Telecommunications: Utilized in communication infrastructure, the XCV300E-8FG456C processes high-speed signals for routers and switches, improving bandwidth and data flow management.
- Automotive Systems: Integral to driver assistance systems, this FPGA can manage sensor inputs and actuation commands efficiently, enhancing vehicle safety and performance.
- Consumer Electronics: In devices such as smartphones and tablets, the FPGA enables rapid processing of user inputs and multitasking capabilities, thereby enhancing user experience and device functionality.
- Industrial Automation: The XCV300E-8FG456C drives complex control systems in industrial settings, managing multiple input/output operations that are crucial for automated processes.
- Aerospace and Defense: Applied in avionics and military equipment, the FPGA supports robust data processing requirements essential for navigation and surveillance systems.
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