XCV300-4FG456I

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Mount :

Surface Mount

Packaging :

Tray

Width :

23mm

Number of I/O :

312

Terminal Finish :

Tin/Lead (Sn63Pb37)

Number of Logic Elements/Cells :

6912

Supply Voltage :

2.5V

Operating Temperature :

-40°C~100°C TJ

Package / Case :

456-BBGA

Number of Outputs :

312

Terminal Position :

BOTTOM

Combinatorial Delay of a CLB-Max :

0.8 ns

Pin Count :

456

Speed Grade :

4

Lead Free :

Contains Lead

Number of Gates :

322970

Mounting Type :

Surface Mount

Number of Pins :

456

Published :

2002

Peak Reflow Temperature (Cel) :

225

Operating Supply Voltage :

2.5V

ECCN Code :

EAR99

RoHS Status :

Non-RoHS Compliant

Terminal Pitch :

1mm

Base Part Number :

XCV300

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Time@Peak Reflow Temperature-Max (s) :

30

Pbfree Code :

No

Radiation Hardening :

No

Height Seated (Max) :

2.6mm

Total RAM Bits :

65536

Number of LABs/CLBs :

1536

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

JESD-609 Code :

e0

Series :

Virtex®

RAM Size :

8kB

Clock Frequency :

250MHz

Terminal Form :

Ball

Number of Terminations :

456

Voltage - Supply :

2.375V~2.625V

Length :

23mm