XCV300-4FG456C
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- Mfr.Part #
- XCV300-4FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 836
- In Stock ：
- 836
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.6mm
- Radiation Hardening :
- No
- Packaging :
- Tray
- Total RAM Bits :
- 65536
- Number of Pins :
- 456
- Number of I/O :
- 312
- Mount :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 2.5V
- Clock Frequency :
- 250MHz
- Operating Supply Voltage :
- 2.5V
- Base Part Number :
- XCV300
- RAM Size :
- 8kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 2.375V~2.625V
- RoHS Status :
- Non-RoHS Compliant
- Pbfree Code :
- No
- Width :
- 23mm
- Package / Case :
- 456-BBGA
- Number of Outputs :
- 312
- Published :
- 2002
- JESD-609 Code :
- e0
- Number of Logic Elements/Cells :
- 6912
- Speed Grade :
- 4
- Terminal Position :
- BOTTOM
- Pin Count :
- 456
- Series :
- Virtex®
- Lead Free :
- Contains Lead
- Number of Terminations :
- 456
- Length :
- 23mm
- Number of Gates :
- 322970
- Number of LABs/CLBs :
- 1536
- Mounting Type :
- Surface Mount
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Combinatorial Delay of a CLB-Max :
- 0.8 ns
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- XCV300-4FG456C
FPGAs AMD Xilinx XCV300-4FG456C Overview
Introducing the XCV300-4FG456C from AMD Xilinx, a state-of-the-art FPGA (Field Programmable Gate Array) that embodies flexibility and performance in a compact form factor. This IC is designed to cater to a broad range of applications where high-speed digital computation and versatility are required. With its advanced system-level integration, the XCV300-4FG456C FPGA allows for customizable configurations that can adapt to varying hardware requirements, making it an ideal choice for developers and engineers looking for a scalable solution. This product not only enhances operational efficiencies but also reduces time-to-market, positioning it as a crucial component in developing competitive technological solutions.
XCV300-4FG456C Features
The AMD Xilinx XCV300-4FG456C boasts a robust set of features that make it highly suitable for demanding applications. It includes 312 programmable I/O ports and a 456-ball Fine Pitch Ball Grid Array (FBGA) package that ensures a minimal footprint on the system board while maximizing connectivity. The device's high I/O count and flexible package design facilitate complex, multi-layered designs within compact hardware limits, enhancing both system robustness and reliability.
XCV300-4FG456C Applications
- Telecommunications: In telecom infrastructure, the XCV300-4FG456C can be utilized for signal processing and switching, enhancing the efficiency and reliability of communications networks.
- Automotive Systems: Suitable for use in driver assistance systems, the FPGA can manage sensor inputs and actuator controls, improving vehicle safety and performance.
- Consumer Electronics: This FPGA is ideal for high-definition video processing, allowing it to be used in devices such as smart TVs and gaming consoles, where high performance and real-time processing are essential.
- Industrial Automation: The XCV300-4FG456C facilitates complex control systems and real-time data processing, crucial for robotics and automated manufacturing lines.
- Medical Devices: It supports the development of medical imaging systems, such as X-ray or MRI, by handling high-speed data computation and image processing tasks effectively.
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