XCV300-5FG456I
- Mfr.Part #
- XCV300-5FG456I
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 1
- In Stock :
- 1
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Number of Outputs :
- 312
- Number of I/O :
- 312
- Mount :
- Surface Mount
- ECCN Code :
- EAR99
- Reach Compliance Code :
- not_compliant
- Base Part Number :
- XCV300
- Lead Free :
- Contains Lead
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Package / Case :
- 456-BBGA
- Terminal Position :
- BOTTOM
- RAM Size :
- 8kB
- Power Supplies :
- 1.2/3.62.5V
- Length :
- 23mm
- Pbfree Code :
- No
- Clock Frequency :
- 294MHz
- Published :
- 2002
- Number of Terminations :
- 456
- Total RAM Bits :
- 65536
- JESD-609 Code :
- e0
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Pin Count :
- 456
- Series :
- Virtex®
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 1536
- Number of Logic Elements/Cells :
- 6912
- Operating Temperature :
- -40°C~100°C TJ
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Supply Voltage :
- 2.5V
- Number of Pins :
- 456
- Peak Reflow Temperature (Cel) :
- 225
- Height Seated (Max) :
- 2.6mm
- Qualification Status :
- Not Qualified
- Width :
- 23mm
- Terminal Pitch :
- 1mm
- Number of Gates :
- 322970
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Voltage - Supply :
- 2.375V~2.625V
- Datasheets
- XCV300-5FG456I
XCV300-5FG456I Documents

FPGAs AMD Xilinx XCV300-5FG456I Overview
The FPGAs AMD Xilinx XCV300-5FG456I is a high-performance integrated circuit specifically designed for complex digital processing tasks. This FPGA features a robust architecture that is ideal for handling a multitude of operations in real-time applications. Manufactured by AMD Xilinx, a leader in digital design innovation, this product offers enhanced functionality and flexibility, making it a perfect choice for developers looking to push the boundaries of technology in their projects. With its extensive I/O capabilities and a compact 456FBGA package, it provides a scalable solution that can be tailored to meet the rigorous demands of various high-tech industries.
XCV300-5FG456I Features
This FPGA is equipped with 312 I/O ports, allowing for versatile connectivity and integration into existing systems with ease. The device is housed in a 456-pin fine-pitch Ball Grid Array (FBGA) package, which supports dense circuitry while minimizing space on the PCB. Enhanced with AMD Xilinx's advanced programmable logic technology, the XCV300-5FG456I provides significant advantages in terms of speed, power efficiency, and overall performance.
XCV300-5FG456I Applications
- Telecommunications: Utilized in routing and switching solutions, the XCV300-5FG456I improves signal integrity and data flow efficiency in complex telecom infrastructures.
- Automotive: Integral in driver assistance systems, this FPGA processes multiple sensor data streams to provide real-time responses, enhancing vehicle safety and performance.
- Industrial Automation: Powers control systems and robotics, providing the necessary speed and precision for high-performance automation tasks.
- Medical Devices: Used in imaging and diagnostic equipment, helping in the rapid processing of medical images and data to aid in faster and more accurate diagnoses.
- Consumer Electronics: Drives the functionality of high-end consumer electronics, including smart home devices and portable technology, by enabling sophisticated user interfaces and connectivity features.
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