XCV300-5BG352C
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- Mfr.Part #
- XCV300-5BG352C
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 34,193
- In Stock ：
- 34,193
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Inputs :
- 260
- Qualification Status :
- Not Qualified
- Lead Free :
- Contains Lead
- Clock Frequency :
- 294MHz
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Height Seated (Max) :
- 1.7mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- RoHS Status :
- Non-RoHS Compliant
- Terminal Form :
- Ball
- Voltage - Supply :
- 2.375V~2.625V
- Number of Logic Elements/Cells :
- 6912
- Pbfree Code :
- No
- Number of I/O :
- 260
- Number of Gates :
- 322970
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Published :
- 2000
- RAM Size :
- 8kB
- Series :
- Virtex®
- Width :
- 35mm
- Terminal Pitch :
- 1.27mm
- Base Part Number :
- XCV300
- Reach Compliance Code :
- not_compliant
- Length :
- 35mm
- Operating Temperature :
- 0°C~85°C TJ
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Number of Terminations :
- 352
- Number of LABs/CLBs :
- 1536
- ECCN Code :
- EAR99
- Power Supplies :
- 1.2/3.62.5V
- JESD-30 Code :
- S-PBGA-B352
- Number of Outputs :
- 260
- Supply Voltage :
- 2.5V
- Peak Reflow Temperature (Cel) :
- 225
- JESD-609 Code :
- e0
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 65536
- Pin Count :
- 352
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XCV300-5BG352C
1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV300-5BG352C Overview
The package that contains this software is called 352-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 260 I/Os for better data transfer. In order to construct a fundamental building block, 6912 logic elements/cells are required. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the Virtex® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 260 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 352 terminations. As far as the RAM bits are concerned, this device offers you a total of 65536. If you are looking for related parts, you can use the base part number XCV300 as a starting point. For the program to work properly, the RAM si8kBe of this FPGA module must reach 8kB GB in order to ensure normal operation. 1536 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 1.2/3.62.5V power supply. As a basic building block, fpga semiconductor consists of 322970 gates. A total of 352 pins are included in this device. Most of the time, it uses a crystal oscillating at 294MHz to generate the signal.
XCV300-5BG352C Features
260 I/Os
Up to 65536 RAM bits
XCV300-5BG352C Applications
There are a lot of Xilinx Inc.
XCV300-5BG352C FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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