XCV300E-8FG256C
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- Mfr.Part #
- XCV300E-8FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 2,902
- In Stock ：
- 2,902
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Outputs :
- 176
- RAM Size :
- 16kB
- Pbfree Code :
- No
- Speed Grade :
- 8
- Radiation Hardening :
- No
- Height Seated (Max) :
- 2mm
- Number of Terminations :
- 256
- Terminal Form :
- Ball
- Packaging :
- Tray
- Supply Voltage :
- 1.8V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 6912
- Operating Supply Voltage :
- 1.8V
- ECCN Code :
- EAR99
- Package / Case :
- 256-BGA
- Published :
- 1999
- Operating Temperature :
- 0°C~85°C TJ
- Clock Frequency :
- 416MHz
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Lead Free :
- Contains Lead
- JESD-609 Code :
- e0
- Length :
- 17mm
- Width :
- 17mm
- Terminal Pitch :
- 1mm
- Number of I/O :
- 176
- Number of Pins :
- 256
- RoHS Status :
- Non-RoHS Compliant
- Number of Gates :
- 411955
- Peak Reflow Temperature (Cel) :
- 225
- Series :
- Virtex®-E
- Pin Count :
- 256
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mount :
- Surface Mount
- Total RAM Bits :
- 131072
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Base Part Number :
- XCV300E
- Voltage - Supply :
- 1.71V~1.89V
- Combinatorial Delay of a CLB-Max :
- 0.4 ns
- Number of LABs/CLBs :
- 1536
- Datasheets
- XCV300E-8FG256C
FPGAs AMD Xilinx XCV300E-8FG256C Overview
Introducing the AMD Xilinx XCV300E-8FG256C, a robust FPGA (Field Programmable Gate Array) designed to cater to the high demands of modern digital applications. This product integrates cutting-edge technology to provide a flexible, high-performance solution for electronic engineers and system integrators. The XCV300E-8FG256C is engineered to deliver superior processing capabilities and versatility, making it ideal for a wide range of industrial applications. With its 256FBGA package, it offers a compact footprint while maintaining a rich feature set, including 176 I/O options for extensive connectivity and interfacing possibilities.
XCV300E-8FG256C Features
The XCV300E-8FG256C by AMD Xilinx features a high I/O pin count and a dense 256FBGA package, which makes it exceptionally well-suited for complex digital computations and signal processing tasks. Key features include a configurable logic architecture, allowing for tailored digital circuit design, and advanced power management technologies that ensure efficient operation under varying load conditions. This FPGA also supports multiple design methodologies, accommodating both VHDL and Verilog programming languages, thus offering flexibility in design and implementation strategies.
XCV300E-8FG256C Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and base station equipment, the XCV300E-8FG256C excels in processing complex algorithms essential for real-time signal processing and data transmission.
- Automotive Driver Assistance Systems: Acts as the control center within automotive safety features, managing sensor inputs and actuator outputs to enhance vehicle responsiveness and safety.
- Industrial Automation: Ideal for use in control systems where programmability and adaptability are required, such as in robotic arms and CNC machines, improving precision and productivity.
- Consumer Electronics: Powers advanced consumer electronics, including gaming consoles and high-definition video systems, providing the necessary processing power and connectivity for immersive experiences.
- Medical Devices: Applied in medical imaging systems like ultrasound and MRI, ensuring fast processing speeds that are crucial for high-resolution imaging and real-time diagnostics.
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