XCV300E-7FG456I

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Mfr.Part #
XCV300E-7FG456I
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 312 I/O 456FBGA
Stock
8,917
In Stock :
8,917

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
-40°C~100°C TJ
Number of Terminations :
456
Number of Gates :
411955
Radiation Hardening :
No
Lead Free :
Contains Lead
Series :
Virtex®-E
ECCN Code :
3A991.D
HTS Code :
8542.39.00.01
Base Part Number :
XCV300E
Length :
23mm
Number of LABs/CLBs :
1536
Combinatorial Delay of a CLB-Max :
0.42 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.8V
Peak Reflow Temperature (Cel) :
225
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
312
Mount :
Surface Mount
JESD-609 Code :
e0
Number of Outputs :
312
Terminal Pitch :
1mm
Total RAM Bits :
131072
Number of Equivalent Gates :
82944
Packaging :
Tray
Terminal Position :
BOTTOM
Pin Count :
456
Supply Voltage :
1.8V
Number of Logic Elements/Cells :
6912
RAM Size :
16kB
Terminal Form :
Ball
Clock Frequency :
400MHz
Package / Case :
456-BBGA
Voltage - Supply :
1.71V~1.89V
Pbfree Code :
No
Published :
2006
Width :
23mm
Speed Grade :
7
Height Seated (Max) :
2.6mm
Number of Pins :
456
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7FG456I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Terminations:456, Base Part Number:XCV300E, Mounting Type:Surface Mount, Package / Case:456-BBGA, Number of Pins:456, XCV300E-7FG456I pinout, XCV300E-7FG456I datasheet PDF, XCV300E-7FG456I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7FG456I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV300E-7FG456I


FPGAs AMD Xilinx XCV300E-7FG456I Overview

AMD Xilinx的XCV300E-7FG456I是高性能的FPGAs(Field Programmable Gate Array)器件,适用于各种复杂应用。这款FPGA拥有312个可编程I/O接口和456FBGA封装,提供卓越的灵活性和可扩展性,满足不同设计需求。这种多功能的IC非常适合需要高计算能力、低延迟和高吞吐量的应用,例如数字信号处理、嵌入式系统和高速通信。对于寻求稳定和高效解决方案的B端客户,FPGAs AMD Xilinx XCV300E-7FG456I是值得考虑的选择。其灵活性和性能特征使其在许多行业中都具有吸引力,包括电信、工业自动化和医疗设备。

XCV300E-7FG456I Features

- 312个可编程I/O接口,满足多样化的连接需求 - 456FBGA封装,提供高密度封装解决方案 - 支持高速通信,适用于网络和电信行业 - 灵活的设计架构,方便根据需求进行定制和调整 - 适用于数字信号处理和嵌入式系统,满足复杂计算需求

XCV300E-7FG456I Applications

- **电信设备**:该FPGA可以用于高速信号处理和数据传输,适用于网络路由器和交换机。 - **工业自动化**:在工业控制和自动化系统中,FPGA提供了高可靠性和低延迟的特点。 - **医疗设备**:由于其高计算能力和灵活性,该器件可以用于医疗成像和诊断设备。 - **航空航天**:FPGA的耐用性和多功能性使其在航空航天系统中具有应用价值。 - **汽车电子**:在现代汽车的电子系统中,该FPGA可用于高级驾驶辅助系统和车载信息娱乐系统。
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