XCV300E-7FG456C
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- Mfr.Part #
- XCV300E-7FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 1,603
- In Stock ：
- 1,603
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 131072
- Series :
- Virtex®-E
- Number of Gates :
- 411955
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Clock Frequency :
- 400MHz
- RAM Size :
- 16kB
- Number of Terminations :
- 456
- Pbfree Code :
- No
- Mount :
- Surface Mount
- Number of Pins :
- 456
- JESD-609 Code :
- e0
- Base Part Number :
- XCV300E
- Mounting Type :
- Surface Mount
- Lead Free :
- Contains Lead
- Width :
- 23mm
- Supply Voltage :
- 1.8V
- Terminal Form :
- Ball
- Packaging :
- Tray
- Height Seated (Max) :
- 2.6mm
- Number of Outputs :
- 312
- Speed Grade :
- 7
- Length :
- 23mm
- Operating Temperature :
- 0°C~85°C TJ
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 312
- Voltage - Supply :
- 1.71V~1.89V
- Operating Supply Voltage :
- 1.8V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 6912
- Terminal Pitch :
- 1mm
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 1536
- Pin Count :
- 456
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Radiation Hardening :
- No
- Package / Case :
- 456-BBGA
- Number of Equivalent Gates :
- 82944
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2006
- Peak Reflow Temperature (Cel) :
- 225
- ECCN Code :
- 3A991.D
- Datasheets
- XCV300E-7FG456C
XCV300E-7FG456C Documents
FPGAs AMD Xilinx XCV300E-7FG456C Overview
Introducing the AMD Xilinx XCV300E-7FG456C, a high-performance FPGA (Field Programmable Gate Array) designed to cater to the complex and demanding requirements of modern digital circuits. This advanced FPGA provides a robust platform for designing and deploying a wide range of applications, from consumer electronics to industrial automation systems. Its large array of 312 I/Os and a compact 456FBGA package ensure versatility and high-density integration, making the AMD Xilinx XCV300E-7FG456C an ideal choice for designers seeking efficiency, reliability, and high-speed performance in their digital and mixed-signal applications.
XCV300E-7FG456C Features
The AMD Xilinx XCV300E-7FG456C boasts an array of features that enhance its usability and functionality in various applications. It includes a substantial number of I/O ports that support a wide range of input and output types, offering flexibility in connecting different peripherals and systems. The 456FBGA packaging not only reduces the overall footprint but also enhances thermal management and signal integrity. Furthermore, this FPGA is capable of supporting high-speed digital processing, which is essential for handling complex algorithms and large data sets in real-time applications.
XCV300E-7FG456C Applications
- Telecommunications Equipment: The FPGA's high-speed I/O interfaces and robust signal processing capabilities make it suitable for routers, switches, and other networking equipment, where it can manage data flow efficiently and reliably.
- Automotive Systems: Used in vehicle systems for controlling functions such as engine management and infotainment systems, its capacity to handle real-time data and support a range of sensors and actuators is critical.
- Consumer Electronics: Ideal for high-performance consumer electronics like gaming consoles and high-definition video systems, where its ability to process complex graphics and data algorithms enhances user experience.
- Industrial Automation: In industrial settings, the XCV300E-7FG456C can be utilized for controlling robotic arms, sensors, and other machinery, providing precise control and reliable operation under various environmental conditions.
- Aerospace and Defense: Its robust design and capacity for high-level data encryption make it suitable for applications in aerospace and defense, including guidance systems and secure communication devices.
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