XCV300E-7BG432I

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Mfr.Part #
XCV300E-7BG432I
Manufacturer
AMD Xilinx
Package / Case
432-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 316 I/O 432MBGA
Stock
45,486
In Stock :
45,486

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
XCV300E
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
Non-RoHS Compliant
HTS Code :
8542.39.00.01
Number of Outputs :
316
Series :
Virtex®-E
Operating Temperature :
-40°C~100°C TJ
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
225
Published :
2006
ECCN Code :
3A991.D
Time@Peak Reflow Temperature-Max (s) :
30
JESD-30 Code :
S-PBGA-B432
Total RAM Bits :
131072
Length :
40mm
Number of Terminations :
432
Mount :
Surface Mount
Package / Case :
432-LBGA Exposed Pad, Metal
Combinatorial Delay of a CLB-Max :
0.42 ns
Pin Count :
432
Mounting Type :
Surface Mount
Number of LABs/CLBs :
1536
JESD-609 Code :
e0
Number of Gates :
411955
Number of Logic Elements/Cells :
6912
Terminal Form :
Ball
Terminal Position :
BOTTOM
Number of Equivalent Gates :
82944
Lead Free :
Contains Lead
Width :
40mm
RAM Size :
16kB
Supply Voltage :
1.8V
Voltage - Supply :
1.71V~1.89V
Number of Inputs :
316
Speed Grade :
7
Packaging :
Tray
Operating Supply Voltage :
1.8V
Radiation Hardening :
No
Pbfree Code :
No
Clock Frequency :
400MHz
Number of I/O :
316
Datasheets
XCV300E-7BG432I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7BG432I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XCV300E, Operating Temperature:-40°C~100°C TJ, Number of Terminations:432, Package / Case:432-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, XCV300E-7BG432I pinout, XCV300E-7BG432I datasheet PDF, XCV300E-7BG432I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7BG432I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V FPGAs Virtex®-E Series 432-LBGA Exposed Pad, Metal 432

XCV300E-7BG432I Overview


In the package 432-LBGA Exposed Pad, Metal, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 316 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 6912 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 316 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 432. Fpga electronics is worth mentioning that this device provides 131072 bfpga electronics s of RAM. XCV300E is the base part number that can be used to identify related parts. The RAM si16kBe of this FPGA module reaches 16kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 1536 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 411955 gates. I am going to present you with a device that is equipped with 432 pins. Fpga semiconductor typically uses a crystal oscillating at 400MHz. There are 82944 equivalent gates implemented by the FPGA in order to implement the design.

XCV300E-7BG432I Features


316 I/Os
Up to 131072 RAM bits


XCV300E-7BG432I Applications


There are a lot of Xilinx Inc.
XCV300E-7BG432I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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