XCV300E-7BG352I
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- Mfr.Part #
- XCV300E-7BG352I
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 33,733
- In Stock ：
- 33,733
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Terminations :
- 352
- Number of Logic Elements/Cells :
- 6912
- JESD-30 Code :
- S-PBGA-B352
- Combinatorial Delay of a CLB-Max :
- 0.42 ns
- Number of Outputs :
- 260
- Base Part Number :
- XCV300E
- Mount :
- Surface Mount
- Number of I/O :
- 260
- Speed Grade :
- 7
- Operating Supply Voltage :
- 1.8V
- Number of LABs/CLBs :
- 1536
- JESD-609 Code :
- e0
- Pin Count :
- 352
- Operating Temperature :
- -40°C~100°C TJ
- ECCN Code :
- EAR99
- Pbfree Code :
- No
- Width :
- 35mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Equivalent Gates :
- 82944
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 35mm
- Supply Voltage :
- 1.8V
- Clock Frequency :
- 400MHz
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- Terminal Position :
- BOTTOM
- Radiation Hardening :
- No
- Terminal Form :
- Ball
- RAM Size :
- 16kB
- Number of Gates :
- 411955
- Peak Reflow Temperature (Cel) :
- 225
- Voltage - Supply :
- 1.71V~1.89V
- Packaging :
- Tray
- Number of Inputs :
- 260
- Total RAM Bits :
- 131072
- Published :
- 2012
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lead Free :
- Contains Lead
- Series :
- Virtex®-E
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Datasheets
- XCV300E-7BG352I
XCV300E-7BG352I Documents
1.8V V FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 352
XCV300E-7BG352I Overview
Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 6912 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 131072. Its base part number XCV300E can be used to find related parts. The RAM si16kBe of this FPGA module reaches 16kB to ensure normal operation of the program. This FPGA is built as an array of 1536 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. Its basic building block contains 411955 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 400MHz . 82944 equivalent gates are used for the design implement in the FPGA.
XCV300E-7BG352I Features
260 I/Os
Up to 131072 RAM bits
XCV300E-7BG352I Applications
There are a lot of Xilinx Inc.
XCV300E-7BG352I FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
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