XCV300E-7BG352I

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Mfr.Part #
XCV300E-7BG352I
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 260 I/O 352MBGA
Stock
33,733
In Stock :
33,733

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
JESD-30 Code :
S-PBGA-B352
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
1.8V
Published :
2012
Number of Gates :
411955
Pin Count :
352
Packaging :
Tray
Terminal Position :
BOTTOM
Number of Equivalent Gates :
82944
JESD-609 Code :
e0
Number of Inputs :
260
Clock Frequency :
400MHz
Package / Case :
352-LBGA Exposed Pad, Metal
Peak Reflow Temperature (Cel) :
225
Width :
35mm
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
Non-RoHS Compliant
Series :
Virtex®-E
RAM Size :
16kB
Total RAM Bits :
131072
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Outputs :
260
Base Part Number :
XCV300E
ECCN Code :
EAR99
Number of I/O :
260
Terminal Form :
Ball
Voltage - Supply :
1.71V~1.89V
Supply Voltage :
1.8V
Mount :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Lead Free :
Contains Lead
Radiation Hardening :
No
Number of Logic Elements/Cells :
6912
Mounting Type :
Surface Mount
Number of LABs/CLBs :
1536
Pbfree Code :
No
Speed Grade :
7
Number of Terminations :
352
Length :
35mm
Combinatorial Delay of a CLB-Max :
0.42 ns
Datasheets
XCV300E-7BG352I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7BG352I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:352-LBGA Exposed Pad, Metal, Base Part Number:XCV300E, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Number of Terminations:352, XCV300E-7BG352I pinout, XCV300E-7BG352I datasheet PDF, XCV300E-7BG352I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7BG352I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 352

XCV300E-7BG352I Overview


Fpga chips is supplied in the 352-LBGA Exposed Pad, Metal package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 260 I/Os for transferring data in a more coherent manner. There are 6912 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Virtex®-E seies. The operating temperature should be kept at -40°C~100°C TJ when operating. There are 260 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 352 terminations. The RAM bits that this device offer is 131072. Its base part number XCV300E can be used to find related parts. The RAM si16kBe of this FPGA module reaches 16kB to ensure normal operation of the program. This FPGA is built as an array of 1536 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. Its basic building block contains 411955 gates. Fpga semiconductor is equipped wfpga semiconductorh 352 pin count. Typically, fpga semiconductor uses a crystal oscillating at 400MHz . 82944 equivalent gates are used for the design implement in the FPGA.

XCV300E-7BG352I Features


260 I/Os
Up to 131072 RAM bits


XCV300E-7BG352I Applications


There are a lot of Xilinx Inc.
XCV300E-7BG352I FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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