XCV300E-7BG352C

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Mfr.Part #
XCV300E-7BG352C
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 260 I/O 352MBGA
Stock
24,531
In Stock :
24,531

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
30
Speed Grade :
7
Package / Case :
352-LBGA Exposed Pad, Metal
Mounting Type :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Voltage - Supply :
1.71V~1.89V
Packaging :
Tray
Number of Logic Elements/Cells :
6912
Radiation Hardening :
No
HTS Code :
8542.39.00.01
JESD-609 Code :
e0
Number of I/O :
260
ECCN Code :
EAR99
RAM Size :
16kB
Base Part Number :
XCV300E
Series :
Virtex®-E
Clock Frequency :
400MHz
Number of Terminations :
352
Number of Gates :
411955
Width :
35mm
Number of LABs/CLBs :
1536
Pbfree Code :
No
Operating Supply Voltage :
1.8V
Number of Inputs :
260
JESD-30 Code :
S-PBGA-B352
Number of Equivalent Gates :
82944
Length :
35mm
Terminal Position :
BOTTOM
Published :
1999
Total RAM Bits :
131072
Combinatorial Delay of a CLB-Max :
0.42 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Outputs :
260
RoHS Status :
Non-RoHS Compliant
Peak Reflow Temperature (Cel) :
225
Pin Count :
352
Supply Voltage :
1.8V
Terminal Form :
Ball
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Lead Free :
Contains Lead
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7BG352C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:352-LBGA Exposed Pad, Metal, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Base Part Number:XCV300E, Number of Terminations:352, XCV300E-7BG352C pinout, XCV300E-7BG352C datasheet PDF, XCV300E-7BG352C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-7BG352C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 352

XCV300E-7BG352C Overview


A 352-LBGA Exposed Pad, Metal package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 260 I/Os help it transfer data more efficiently. A fundamental building block contains 6912 logic elements or cells. Power is provided by a 1.8V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.71V~1.89V and uses a battery to supply power. FPGAs belonging to the Virtex®-E series are a type of FPGA that belong to the Virtex®-E series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 260 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 352 terminations on fpga chips. Having a RAM bit size of 131072 means that this device will offer you a lot of memory. For related parts, use its base part number XCV300E. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. 1536 LABs/CLBs are integrated into this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.8V supply voltage, designers can fully utilize the flexibility of the device. 411955 gates make up the basic block of its construction. Featuring 352 pins in total, it is a versatile device. Most commonly, this device makes use of an oscillating crystal frequency of 400MHz to operate. There are 82944 equivalent gates in the FPGA that implement the design.

XCV300E-7BG352C Features


260 I/Os
Up to 131072 RAM bits


XCV300E-7BG352C Applications


There are a lot of Xilinx Inc.
XCV300E-7BG352C FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
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