XCV300E-6FG456I
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- Mfr.Part #
- XCV300E-6FG456I
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 47,599
- In Stock ：
- 47,599
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Width :
- 23mm
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Radiation Hardening :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Number of Pins :
- 456
- Operating Temperature :
- -40°C~100°C TJ
- Total RAM Bits :
- 131072
- Clock Frequency :
- 357MHz
- Number of Outputs :
- 312
- ECCN Code :
- 3A991.D
- Published :
- 1999
- Base Part Number :
- XCV300E
- Number of Logic Elements/Cells :
- 6912
- Package / Case :
- 456-BBGA
- Terminal Pitch :
- 1mm
- Number of I/O :
- 312
- Voltage - Supply :
- 1.71V~1.89V
- Number of LABs/CLBs :
- 1536
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 16kB
- Lead Free :
- Contains Lead
- Terminal Position :
- BOTTOM
- Length :
- 23mm
- Speed Grade :
- 6
- JESD-609 Code :
- e0
- Number of Equivalent Gates :
- 82944
- Number of Terminations :
- 456
- Series :
- Virtex®-E
- Pin Count :
- 456
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- Operating Supply Voltage :
- 1.8V
- Pbfree Code :
- No
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 1.8V
- Number of Gates :
- 411955
- Datasheets
- XCV300E-6FG456I
FPGAs AMD Xilinx XCV300E-6FG456I Overview
The FPGAs AMD Xilinx XCV300E-6FG456I is a highly versatile and powerful field programmable gate array (FPGA) designed for advanced digital processing applications. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA features a robust architecture that supports a wide range of functionalities. The XCV300E-6FG456I is packaged in a 456FBGA (Fine Pitch Ball Grid Array), offering substantial I/O capabilities with 312 programmable I/O ports, making it an excellent choice for developers looking to implement complex designs with stringent space and performance requirements.
XCV300E-6FG456I Features
This FPGA model stands out due to its high functionality in a compact form factor. It supports a wide voltage range and is characterized by its low-power consumption and high processing capacity. The presence of 456FBGA packaging allows for efficient thermal management and space utilization, making it suitable for densely packed electronic assemblies. Additionally, the device is equipped with advanced security features to protect against potential threats and ensure the integrity of the applications it powers.
XCV300E-6FG456I Applications
- Telecommunications Equipment: The XCV300E-6FG456I can be used to develop complex DSP algorithms necessary for modern communication systems, such as 5G base stations and satellite communications.
- Automotive Electronics: This FPGA is ideal for managing multiple sensor inputs and real-time processing in advanced driver-assistance systems (ADAS), providing the necessary computational power and connectivity options.
- Industrial Automation: Its robust I/O capability and adaptability make it perfect for controlling machinery, process automation, and robotics within industrial settings, where reliability and precision are critical.
- Consumer Electronics: Utilized in devices requiring high-speed signal processing and connectivity, such as high-definition video processing units and gaming consoles.
- Medical Devices: Suitable for medical imaging systems, where its capacity to handle complex algorithms helps in delivering faster, more accurate diagnostic results.
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