XCV300E-6FG256I
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- Mfr.Part #
- XCV300E-6FG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 37,009
- In Stock ：
- 37,009
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Lead Free :
- Contains Lead
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- XCV300E
- Series :
- Virtex®-E
- Terminal Position :
- BOTTOM
- Pbfree Code :
- No
- Number of LABs/CLBs :
- 1536
- Supply Voltage :
- 1.8V
- RAM Size :
- 16kB
- Length :
- 17mm
- Operating Temperature :
- -40°C~100°C TJ
- Total RAM Bits :
- 131072
- Peak Reflow Temperature (Cel) :
- 225
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 1.71V~1.89V
- Number of Outputs :
- 176
- Number of Gates :
- 411955
- Number of Equivalent Gates :
- 82944
- Package / Case :
- 256-BGA
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Terminal Form :
- Ball
- Radiation Hardening :
- No
- Pin Count :
- 256
- ECCN Code :
- EAR99
- Mount :
- Surface Mount
- Number of Terminations :
- 256
- Published :
- 2006
- Operating Supply Voltage :
- 1.8V
- Width :
- 17mm
- Number of Logic Elements/Cells :
- 6912
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 357MHz
- RoHS Status :
- Non-RoHS Compliant
- Number of I/O :
- 176
- Speed Grade :
- 6
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 2mm
- Number of Pins :
- 256
- Datasheets
- XCV300E-6FG256I
XCV300E-6FG256I Documents
FPGAs AMD Xilinx XCV300E-6FG256I Overview
The AMD Xilinx XCV300E-6FG256I is a high-performance FPGA (Field Programmable Gate Array) designed to meet the intensive demands of modern digital circuits. With a robust 256FBGA package, it offers ample I/O capabilities with 176 inputs and outputs, making it an excellent choice for designers looking to implement complex logic designs and data processing algorithms. The integration of advanced technology in the XCV300E-6FG256I allows for superior performance, flexibility, and scalability, which are essential for applications requiring high-speed data transmission and processing. This FPGA is tailored to assist engineers in creating more efficient, reliable, and scalable electronic solutions.
XCV300E-6FG256I Features
The XCV300E-6FG256I from AMD Xilinx boasts several key features that make it a top contender in the FPGA market. These include its 256FBGA packaging which enhances the robustness and durability of the module, 176 I/O pins enabling versatile connectivity options, and high-speed performance suitable for a wide range of applications. Additionally, the FPGA is designed for low power consumption, making it ideal for power-sensitive applications.
XCV300E-6FG256I Applications
- Telecommunications Infrastructure: Utilized in routers and switches for processing high-speed data and managing multiple data streams efficiently.
- Automotive Electronics: Integrated into driver assistance systems to process sensor data and support real-time decision making.
- Industrial Automation: Serves as the core processing unit in complex industrial machines for handling control tasks and real-time operations.
- Consumer Electronics: Used in high-definition multimedia interfaces and gaming consoles to enhance graphical processing and user experience.
- Medical Devices: Forms part of diagnostic equipment where high-speed data processing and precise control are crucial.
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