XCV300E-6BG432C

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Mfr.Part #
XCV300E-6BG432C
Manufacturer
AMD Xilinx
Package / Case
432-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 316 I/O 432MBGA
Stock
4,683
In Stock :
4,683

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Inputs :
316
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
316
Series :
Virtex®-E
Operating Supply Voltage :
1.8V
Mount :
Surface Mount
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
Total RAM Bits :
131072
Terminal Form :
Ball
Number of Terminations :
432
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Number of Outputs :
316
Operating Temperature :
0°C~85°C TJ
Number of Equivalent Gates :
82944
Package / Case :
432-LBGA Exposed Pad, Metal
Height Seated (Max) :
1.7mm
Terminal Pitch :
1.27mm
ECCN Code :
3A991.D
Width :
40mm
JESD-30 Code :
S-PBGA-B432
RoHS Status :
Non-RoHS Compliant
Number of Logic Elements/Cells :
6912
Peak Reflow Temperature (Cel) :
225
Speed Grade :
6
Number of LABs/CLBs :
1536
Supply Voltage :
1.8V
Number of Gates :
411955
Published :
2006
Voltage - Supply :
1.71V~1.89V
Time@Peak Reflow Temperature-Max (s) :
30
Combinatorial Delay of a CLB-Max :
0.47 ns
Pin Count :
432
Length :
40mm
Lead Free :
Contains Lead
RAM Size :
16kB
Pbfree Code :
No
Base Part Number :
XCV300E
JESD-609 Code :
e0
Clock Frequency :
357MHz
Radiation Hardening :
No
Datasheets
XCV300E-6BG432C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-6BG432C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:432, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:432-LBGA Exposed Pad, Metal, Base Part Number:XCV300E, XCV300E-6BG432C pinout, XCV300E-6BG432C datasheet PDF, XCV300E-6BG432C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-6BG432C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 432-LBGA Exposed Pad, Metal 1.27mm mm 432

XCV300E-6BG432C Overview


The package that contains this software is called 432-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 316 I/Os for better data transfer. In order to construct a fundamental building block, 6912 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.71V~1.89V battery. There are many types of FPGAs in the Virtex®-E series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 316 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 432 terminations. As far as the RAM bits are concerned, this device offers you a total of 131072. If you are looking for related parts, you can use the base part number XCV300E as a starting point. For the program to work properly, the RAM si16kBe of this FPGA module must reach 16kB GB in order to ensure normal operation. 1536 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. As a basic building block, fpga semiconductor consists of 411955 gates. A total of 432 pins are included in this device. Most of the time, it uses a crystal oscillating at 357MHz to generate the signal. The FPGA implements the design using 82944 equivalent gates.

XCV300E-6BG432C Features


316 I/Os
Up to 131072 RAM bits


XCV300E-6BG432C Applications


There are a lot of Xilinx Inc.
XCV300E-6BG432C FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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