XCV300E-6BG352I
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- Mfr.Part #
- XCV300E-6BG352I
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 36,479
- In Stock ：
- 36,479
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 260
- Radiation Hardening :
- No
- Terminal Pitch :
- 1.27mm
- Number of Outputs :
- 260
- Number of LABs/CLBs :
- 1536
- Clock Frequency :
- 357MHz
- RoHS Status :
- Non-RoHS Compliant
- Number of Equivalent Gates :
- 82944
- Height Seated (Max) :
- 1.7mm
- Speed Grade :
- 6
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e0
- RAM Size :
- 16kB
- Series :
- Virtex®-E
- JESD-30 Code :
- S-PBGA-B352
- Length :
- 35mm
- Pbfree Code :
- No
- Number of Gates :
- 411955
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 225
- Total RAM Bits :
- 131072
- Base Part Number :
- XCV300E
- Published :
- 2006
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Number of Inputs :
- 260
- Number of Terminations :
- 352
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Operating Temperature :
- -40°C~100°C TJ
- Lead Free :
- Contains Lead
- Operating Supply Voltage :
- 1.8V
- Number of Logic Elements/Cells :
- 6912
- Voltage - Supply :
- 1.71V~1.89V
- ECCN Code :
- EAR99
- Supply Voltage :
- 1.8V
- Pin Count :
- 352
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 35mm
- Terminal Form :
- Ball
- Datasheets
- XCV300E-6BG352I
1.8V V 1.7mm mm FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV300E-6BG352I Overview
This package is included in the 352-LBGA Exposed Pad, Metal package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.8V volts power it. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.71V~1.89V . An FPGA belonging to the Virtex®-E series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. With this device, you will be able to make use of 260 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 352. This device is equipped with 131072 RAM bits in terms of its RAM si131072e. Parts related to this part can be found using its base part number XCV300E. During the configuration of this FPGA module, the RAM si16kBe reaches 16kB to ensure that the program runs normally. An array of 1536 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.8V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 411955 gates as fpga semiconductors basic building block. The device has a total of 352 pins on fpga semiconductor. A crystal oscillating at 357MHz is one of the most common components of this device. There are 82944 equivalent gates in the FPGA that implement the design.
XCV300E-6BG352I Features
260 I/Os
Up to 131072 RAM bits
XCV300E-6BG352I Applications
There are a lot of Xilinx Inc.
XCV300E-6BG352I FPGAs applications.
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
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