XCV300E-6BG352C

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Mfr.Part #
XCV300E-6BG352C
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 260 I/O 352MBGA
Stock
407
In Stock :
407

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Combinatorial Delay of a CLB-Max :
0.47 ns
HTS Code :
8542.39.00.01
JESD-30 Code :
S-PBGA-B352
Height Seated (Max) :
1.7mm
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Number of LABs/CLBs :
1536
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
Non-RoHS Compliant
Package / Case :
352-LBGA Exposed Pad, Metal
Number of Equivalent Gates :
82944
Number of Terminations :
352
Operating Supply Voltage :
1.8V
Number of Outputs :
260
Speed Grade :
6
JESD-609 Code :
e0
Width :
35mm
Terminal Pitch :
1.27mm
Pbfree Code :
No
RAM Size :
16kB
Voltage - Supply :
1.71V~1.89V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
131072
Terminal Position :
BOTTOM
Number of I/O :
260
Packaging :
Tray
Terminal Form :
Ball
Base Part Number :
XCV300E
Peak Reflow Temperature (Cel) :
225
Supply Voltage :
1.8V
Lead Free :
Contains Lead
Number of Inputs :
260
Number of Gates :
411955
Length :
35mm
Number of Logic Elements/Cells :
6912
Radiation Hardening :
No
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Series :
Virtex®-E
Published :
2000
ECCN Code :
3A991.D
Clock Frequency :
357MHz
Pin Count :
352
Datasheets
XCV300E-6BG352C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-6BG352C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:352-LBGA Exposed Pad, Metal, Number of Terminations:352, Base Part Number:XCV300E, XCV300E-6BG352C pinout, XCV300E-6BG352C datasheet PDF, XCV300E-6BG352C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300E-6BG352C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.8V V 1.7mm mm FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

XCV300E-6BG352C Overview


There are two packages that contain fpga chips: 352-LBGA Exposed Pad, Metal package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 260 I/Os makes data transfers more coherent. Logic blocks consist of 6912 logic elements/cells. The supply voltage is 1.8V volts. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 1.71V~1.89V , at which it runs. The Virtex®-E series FPGA is a type of FPGA that belongs to the Virtex®-E family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. This device is equipped with 260 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. In total, it has 352 terminations on each end. A device like this one offers 131072 RAM bits, which is a considerable amount of memory. In order to find related parts, use the part number XCV300E as a base. This FPGA module has a RAM si16kBe of 16kB that is sufficient to make sure that the program is able to run normally. A total of 1536 LABs/CLBs make up this FPGA array. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. The 1.8V supply voltage provides designers with full flexibility in their designs. The building block that forms the basis of the system contains 411955 gates. This device has a pin count of 352 in fpga semiconductor. It usually uses a crystal oscillating at a frequency of 357MHz in order to do its work. The FPGA implements the design by using 82944 equivalent gates in order to achieve the desired result.

XCV300E-6BG352C Features


260 I/Os
Up to 131072 RAM bits


XCV300E-6BG352C Applications


There are a lot of Xilinx Inc.
XCV300E-6BG352C FPGAs applications.


  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
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