XCV300-6FG456C
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- Mfr.Part #
- XCV300-6FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 456FBGA
- Stock
- 6,068
- In Stock ：
- 6,068
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 456-BBGA
- Number of Outputs :
- 312
- Operating Temperature :
- 0°C~85°C TJ
- JESD-609 Code :
- e0
- Number of I/O :
- 312
- Pbfree Code :
- No
- Height Seated (Max) :
- 2.6mm
- Terminal Pitch :
- 1mm
- Width :
- 23mm
- Qualification Status :
- Not Qualified
- Number of LABs/CLBs :
- 1536
- Reach Compliance Code :
- not_compliant
- Pin Count :
- 456
- Total RAM Bits :
- 65536
- Number of Logic Elements/Cells :
- 6912
- RoHS Status :
- Non-RoHS Compliant
- Number of Pins :
- 456
- ECCN Code :
- EAR99
- Voltage - Supply :
- 2.375V~2.625V
- Supply Voltage :
- 2.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Virtex®
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Number of Gates :
- 322970
- Power Supplies :
- 1.2/3.62.5V
- Mount :
- Surface Mount
- RAM Size :
- 8kB
- Clock Frequency :
- 333MHz
- Terminal Form :
- Ball
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Published :
- 2000
- Terminal Position :
- BOTTOM
- Lead Free :
- Contains Lead
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 456
- Peak Reflow Temperature (Cel) :
- 225
- Length :
- 23mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XCV300
- Datasheets
- XCV300-6FG456C
XCV300-6FG456C Documents
FPGAs AMD Xilinx XCV300-6FG456C Overview
The FPGAs AMD Xilinx XCV300-6FG456C represents a high-performance, field-programmable gate array designed to meet the extensive needs of modern digital circuits. This advanced IC FPGA from AMD Xilinx boasts a configuration of 312 I/O pins packaged neatly into a 456FBGA (Fine Pitch Ball Grid Array), making it ideally suited for robust applications requiring a dense, high-speed programmable logic solution. The product is engineered to support complex digital processing functions while maintaining a flexible and efficient usability footprint, making it a go-to choice for developers and engineers looking to push the boundaries of technology in various sectors.
XCV300-6FG456C Features
The XCV300-6FG456C FPGA includes several key features that make it a powerful component in any hardware designer's toolkit. Notable among these are its high I/O pin count, flexible logic allocation, and compatibility with AMD Xilinx’s development environments. This FPGA supports a wide range of digital and mixed-signal applications, offering not only versatility but also high performance and reliability. Its small form factor and efficient power management further enhance its suitability for sophisticated, high-density applications that require careful balancing of space and power.
XCV300-6FG456C Applications
- Telecommunications Equipment: Utilized in routers, switches, and base stations, the XCV300-6FG456C facilitates rapid data processing and increased bandwidth capabilities essential for modern telecom infrastructures.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision-making, crucial for safety and performance enhancements in vehicles.
- Consumer Electronics: Ideal for high-performance computing devices like gaming consoles and smart TVs, where high-speed signal processing and enhanced graphical outputs are necessary.
- Industrial Automation: Used in control systems that require complex logic operations and robust performance to maintain efficiency and reliability in automated production lines.
- Medical Devices: Assists in the processing of complex data in medical imaging equipment, such as MRI and ultrasound machines, ensuring precision and reliability in diagnostics.
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