XCV300-6BG352C

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Mfr.Part #
XCV300-6BG352C
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 260 I/O 352MBGA
Stock
15,154
In Stock :
15,154

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
1536
Pbfree Code :
No
Number of Inputs :
260
Pin Count :
352
Reach Compliance Code :
not_compliant
Length :
35mm
HTS Code :
8542.39.00.01
Width :
35mm
JESD-609 Code :
e0
Supply Voltage :
2.5V
Height Seated (Max) :
1.7mm
Clock Frequency :
333MHz
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Number of Terminations :
352
Mount :
Surface Mount
Peak Reflow Temperature (Cel) :
225
Number of Gates :
322970
Terminal Pitch :
1.27mm
Package / Case :
352-LBGA Exposed Pad, Metal
RAM Size :
8kB
Lead Free :
Contains Lead
Base Part Number :
XCV300
Number of I/O :
260
ECCN Code :
EAR99
Series :
Virtex®
Terminal Position :
BOTTOM
Number of Outputs :
260
Mounting Type :
Surface Mount
Terminal Finish :
Tin/Lead (Sn63Pb37)
Packaging :
Tray
Total RAM Bits :
65536
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~85°C TJ
JESD-30 Code :
S-PBGA-B352
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
6912
Published :
2000
Combinatorial Delay of a CLB-Max :
0.6 ns
Voltage - Supply :
2.375V~2.625V
Power Supplies :
1.2/3.62.5V
Datasheets
XCV300-6BG352C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300-6BG352C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:352, Package / Case:352-LBGA Exposed Pad, Metal, Base Part Number:XCV300, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, XCV300-6BG352C pinout, XCV300-6BG352C datasheet PDF, XCV300-6BG352C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV300-6BG352C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

XCV300-6BG352C Overview


A 352-LBGA Exposed Pad, Metal package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 260 I/Os help it transfer data more efficiently. A fundamental building block contains 6912 logic elements or cells. Power is provided by a 2.5V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 2.375V~2.625V and uses a battery to supply power. FPGAs belonging to the Virtex® series are a type of FPGA that belong to the Virtex® series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 260 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 352 terminations on fpga chips. Having a RAM bit size of 65536 means that this device will offer you a lot of memory. For related parts, use its base part number XCV300. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. 1536 LABs/CLBs are integrated into this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. Power is supplied to the device by a 1.2/3.62.5V battery. 322970 gates make up the basic block of its construction. Featuring 352 pins in total, it is a versatile device. Most commonly, this device makes use of an oscillating crystal frequency of 333MHz to operate.

XCV300-6BG352C Features


260 I/Os
Up to 65536 RAM bits


XCV300-6BG352C Applications


There are a lot of Xilinx Inc.
XCV300-6BG352C FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
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