XCV200E-8BG352C
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- Mfr.Part #
- XCV200E-8BG352C
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 7,271
- In Stock ：
- 7,271
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Base Part Number :
- XCV200E
- Number of LABs/CLBs :
- 1176
- Width :
- 35mm
- Radiation Hardening :
- No
- Total RAM Bits :
- 114688
- Operating Supply Voltage :
- 1.8V
- Published :
- 2006
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pbfree Code :
- No
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Number of Equivalent Gates :
- 63504
- Pin Count :
- 352
- RoHS Status :
- Non-RoHS Compliant
- Terminal Pitch :
- 1.27mm
- Terminal Form :
- Ball
- Number of Inputs :
- 260
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Gates :
- 306393
- ECCN Code :
- 3A991.D
- Mount :
- Surface Mount
- Number of Logic Elements/Cells :
- 5292
- Number of Outputs :
- 260
- Series :
- Virtex®-E
- Terminal Position :
- BOTTOM
- Lead Free :
- Contains Lead
- Voltage - Supply :
- 1.71V~1.89V
- Supply Voltage :
- 1.8V
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- Combinatorial Delay of a CLB-Max :
- 0.4 ns
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 1.7mm
- JESD-30 Code :
- S-PBGA-B352
- Peak Reflow Temperature (Cel) :
- 225
- Length :
- 35mm
- Clock Frequency :
- 416MHz
- Operating Temperature :
- 0°C~85°C TJ
- Speed Grade :
- 8
- RAM Size :
- 14kB
- Number of I/O :
- 260
- Number of Terminations :
- 352
- Datasheets
- XCV200E-8BG352C
1.8V V 1.7mm mm FPGAs Virtex®-E Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV200E-8BG352C Overview
In the package 352-LBGA Exposed Pad, Metal, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 260 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 5292 logic elements/cells. Supply voltage is 1.8V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.71V~1.89V, this device operates with ease. This is a type of FPGA that is part of the Virtex®-E series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 260 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 352. Fpga electronics is worth mentioning that this device provides 114688 bfpga electronics s of RAM. XCV200E is the base part number that can be used to identify related parts. The RAM si14kBe of this FPGA module reaches 14kB so as to guarantee the normal operation of the program during operation. The FPGA is built as an array of 1176 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 306393 gates. I am going to present you with a device that is equipped with 352 pins. Fpga semiconductor typically uses a crystal oscillating at 416MHz. There are 63504 equivalent gates implemented by the FPGA in order to implement the design.
XCV200E-8BG352C Features
260 I/Os
Up to 114688 RAM bits
XCV200E-8BG352C Applications
There are a lot of Xilinx Inc.
XCV200E-8BG352C FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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