XCV200-5BG256C
- Mfr.Part #
- XCV200-5BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 180 I/O 256BGA
- Stock
- 26,689
- In Stock :
- 26,689
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XCV200
- Qualification Status :
- Not Qualified
- Mount :
- Surface Mount
- Supply Voltage :
- 2.5V
- Power Supplies :
- 1.2/3.62.5V
- Combinatorial Delay of a CLB-Max :
- 0.7 ns
- Height Seated (Max) :
- 2.55mm
- Lead Free :
- Contains Lead
- Clock Frequency :
- 294MHz
- Reach Compliance Code :
- not_compliant
- Number of Logic Elements/Cells :
- 5292
- Terminal Pitch :
- 1.27mm
- Operating Temperature :
- 0°C~85°C TJ
- Number of Gates :
- 236666
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- RAM Size :
- 7kB
- Pbfree Code :
- No
- Number of LABs/CLBs :
- 1176
- Published :
- 2002
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Terminations :
- 256
- ECCN Code :
- EAR99
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Pins :
- 256
- Number of Outputs :
- 180
- Pin Count :
- 256
- Length :
- 27mm
- Number of I/O :
- 180
- Terminal Form :
- Ball
- Width :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- Virtex®
- Package / Case :
- 256-BBGA
- HTS Code :
- 8542.39.00.01
- RoHS Status :
- Non-RoHS Compliant
- Voltage - Supply :
- 2.375V~2.625V
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 57344
- Datasheets
- XCV200-5BG256C
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FPGAs AMD Xilinx XCV200-5BG256C Overview
The FPGAs AMD Xilinx XCV200-5BG256C is a highly versatile and powerful field-programmable gate array (FPGA) designed for advanced digital circuit development. This integrated circuit, housed in a 256-ball grid array (BGA) package, enables robust design solutions for a myriad of complex electronic applications. It features 180 user I/Os allowing for extensive interfacing capabilities, making it an ideal choice for designers looking to leverage superior flexibility and performance in their next-generation electronic products. The XCV200-5BG256C is tailored to meet the demands of industries requiring high-speed data processing and precise control, including telecommunications, automotive systems, and consumer electronics.
XCV200-5BG256C Features
- 180 I/O Pins: Provides extensive interfacing capabilities, perfect for various applications and customization.
- 256 BGA Packaging: Ensures a compact form factor and reliable electrical connections.
- High Programmability: Offers the flexibility to implement a wide range of designs from simple logic gates to complex system functions.
- Compatibility: Works seamlessly with AMD Xilinx programming tools and development environments.
XCV200-5BG256C Applications
- Telecommunications: Used in the design of communication infrastructure equipment such as routers and switches, where high data throughput and reliability are crucial.
- Automotive Systems: Integrates into driver assistance systems, providing the necessary processing power for real-time decision making and control.
- Consumer Electronics: Employed in the development of high-performance consumer electronics, such as gaming consoles and smart TVs, enhancing user experience with rapid processing capabilities.
- Data Processing: Serves as a core component in data centers for processing large volumes of information efficiently and effectively.
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