XCV200-4PQ240I

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Mfr.Part #
XCV200-4PQ240I
Manufacturer
AMD Xilinx
Package / Case
240-BFQFP
Datasheet
Download
Description
IC FPGA 166 I/O 240QFP
Stock
12,067
In Stock :
12,067

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Reach Compliance Code :
Unknown
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
30
RAM Size :
7kB
Pin Count :
240
Terminal Finish :
Tin/Lead (Sn85Pb15)
Peak Reflow Temperature (Cel) :
225
Combinatorial Delay of a CLB-Max :
0.8 ns
Length :
32mm
Number of Pins :
240
Lead Free :
Contains Lead
Qualification Status :
Not Qualified
Voltage - Supply :
2.375V~2.625V
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
Total RAM Bits :
57344
Number of Gates :
236666
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2002
Number of I/O :
166
Number of Terminations :
240
Packaging :
Tray
Supply Voltage :
2.5V
Base Part Number :
XCV200
ECCN Code :
EAR99
Series :
Virtex®
Package / Case :
240-BFQFP
Height Seated (Max) :
4.1mm
JESD-609 Code :
e0
Clock Frequency :
250MHz
Terminal Form :
Gull wing
Pbfree Code :
No
Width :
32mm
Terminal Pitch :
0.5mm
Mount :
Surface Mount
Number of LABs/CLBs :
1176
Number of Outputs :
166
HTS Code :
8542.39.00.01
Power Supplies :
1.2/3.62.5V
Number of Logic Elements/Cells :
5292
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
QUAD
Datasheets
XCV200-4PQ240I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200-4PQ240I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:240, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Terminations:240, Base Part Number:XCV200, Package / Case:240-BFQFP, XCV200-4PQ240I pinout, XCV200-4PQ240I datasheet PDF, XCV200-4PQ240I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200-4PQ240I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



4.1mm mm FPGAs Virtex® Series 240-BFQFP 0.5mm mm 240

XCV200-4PQ240I Overview


In the package 240-BFQFP, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 166 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 5292 logic elements/cells. Supply voltage is 2.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. This is a type of FPGA that is part of the Virtex® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 166 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 240. Fpga electronics is worth mentioning that this device provides 57344 bfpga electronics s of RAM. XCV200 is the base part number that can be used to identify related parts. The RAM si7kBe of this FPGA module reaches 7kB so as to guarantee the normal operation of the program during operation. The device has 240 pins which are included in the design. The FPGA is built as an array of 1176 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This is a battery operated device that operates on 1.2/3.62.5V. A basic building block for this type of building block consists of 236666 gates. I am going to present you with a device that is equipped with 240 pins. Fpga semiconductor typically uses a crystal oscillating at 250MHz.

XCV200-4PQ240I Features


166 I/Os
Up to 57344 RAM bits
240 LABs/CLBs


XCV200-4PQ240I Applications


There are a lot of Xilinx Inc.
XCV200-4PQ240I FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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