XCV200-4BG352C

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Mfr.Part #
XCV200-4BG352C
Manufacturer
AMD Xilinx
Package / Case
352-LBGA Exposed Pad, Metal
Datasheet
Download
Description
IC FPGA 260 I/O 352MBGA
Stock
46,122
In Stock :
46,122

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
57344
Number of Outputs :
260
Number of Gates :
236666
Lead Free :
Contains Lead
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Terminal Pitch :
1.27mm
Number of I/O :
260
Number of Terminations :
352
Number of Logic Elements/Cells :
5292
Published :
2000
Clock Frequency :
250MHz
Voltage - Supply :
2.375V~2.625V
Series :
Virtex®
ECCN Code :
EAR99
Base Part Number :
XCV200
HTS Code :
8542.39.00.01
JESD-609 Code :
e0
RAM Size :
7kB
Package / Case :
352-LBGA Exposed Pad, Metal
Height Seated (Max) :
1.7mm
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Power Supplies :
1.2/3.62.5V
Terminal Form :
Ball
Terminal Finish :
Tin/Lead (Sn63Pb37)
Pin Count :
352
Supply Voltage :
2.5V
JESD-30 Code :
S-PBGA-B352
Number of LABs/CLBs :
1176
Terminal Position :
BOTTOM
Packaging :
Tray
Reach Compliance Code :
not_compliant
Peak Reflow Temperature (Cel) :
225
Length :
35mm
Combinatorial Delay of a CLB-Max :
0.8 ns
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Pbfree Code :
No
RoHS Status :
Non-RoHS Compliant
Number of Inputs :
260
Qualification Status :
Not Qualified
Width :
35mm
Time@Peak Reflow Temperature-Max (s) :
30
Datasheets
XCV200-4BG352C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200-4BG352C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:352, Base Part Number:XCV200, Package / Case:352-LBGA Exposed Pad, Metal, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XCV200-4BG352C pinout, XCV200-4BG352C datasheet PDF, XCV200-4BG352C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200-4BG352C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352

XCV200-4BG352C Overview


The package that contains this software is called 352-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 260 I/Os for better data transfer. In order to construct a fundamental building block, 5292 logic elements/cells are required. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the Virtex® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 260 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 352 terminations. As far as the RAM bits are concerned, this device offers you a total of 57344. If you are looking for related parts, you can use the base part number XCV200 as a starting point. For the program to work properly, the RAM si7kBe of this FPGA module must reach 7kB GB in order to ensure normal operation. 1176 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 1.2/3.62.5V power supply. As a basic building block, fpga semiconductor consists of 236666 gates. A total of 352 pins are included in this device. Most of the time, it uses a crystal oscillating at 250MHz to generate the signal.

XCV200-4BG352C Features


260 I/Os
Up to 57344 RAM bits


XCV200-4BG352C Applications


There are a lot of Xilinx Inc.
XCV200-4BG352C FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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