XCV200-4BG352C
- Mfr.Part #
- XCV200-4BG352C
- Manufacturer
- AMD Xilinx
- Package / Case
- 352-LBGA Exposed Pad, Metal
- Datasheet
- Download
- Description
- IC FPGA 260 I/O 352MBGA
- Stock
- 46,122
- In Stock :
- 46,122
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 57344
- Number of Outputs :
- 260
- Number of Gates :
- 236666
- Lead Free :
- Contains Lead
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- Terminal Pitch :
- 1.27mm
- Number of I/O :
- 260
- Number of Terminations :
- 352
- Number of Logic Elements/Cells :
- 5292
- Published :
- 2000
- Clock Frequency :
- 250MHz
- Voltage - Supply :
- 2.375V~2.625V
- Series :
- Virtex®
- ECCN Code :
- EAR99
- Base Part Number :
- XCV200
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e0
- RAM Size :
- 7kB
- Package / Case :
- 352-LBGA Exposed Pad, Metal
- Height Seated (Max) :
- 1.7mm
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Power Supplies :
- 1.2/3.62.5V
- Terminal Form :
- Ball
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Pin Count :
- 352
- Supply Voltage :
- 2.5V
- JESD-30 Code :
- S-PBGA-B352
- Number of LABs/CLBs :
- 1176
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Reach Compliance Code :
- not_compliant
- Peak Reflow Temperature (Cel) :
- 225
- Length :
- 35mm
- Combinatorial Delay of a CLB-Max :
- 0.8 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- RoHS Status :
- Non-RoHS Compliant
- Number of Inputs :
- 260
- Qualification Status :
- Not Qualified
- Width :
- 35mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XCV200-4BG352C
1.7mm mm FPGAs Virtex® Series 352-LBGA Exposed Pad, Metal 1.27mm mm 352
XCV200-4BG352C Overview
The package that contains this software is called 352-LBGA Exposed Pad, Metal. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 260 I/Os for better data transfer. In order to construct a fundamental building block, 5292 logic elements/cells are required. In order for the device to operate, a supply voltage of 2.5V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the Virtex® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 260 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 352 terminations. As far as the RAM bits are concerned, this device offers you a total of 57344. If you are looking for related parts, you can use the base part number XCV200 as a starting point. For the program to work properly, the RAM si7kBe of this FPGA module must reach 7kB GB in order to ensure normal operation. 1176 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In order for fpga electronics to work, fpga electronics requires a 1.2/3.62.5V power supply. As a basic building block, fpga semiconductor consists of 236666 gates. A total of 352 pins are included in this device. Most of the time, it uses a crystal oscillating at 250MHz to generate the signal.
XCV200-4BG352C Features
260 I/Os
Up to 57344 RAM bits
XCV200-4BG352C Applications
There are a lot of Xilinx Inc.
XCV200-4BG352C FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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