XCV200-4BG256C

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Mfr.Part #
XCV200-4BG256C
Manufacturer
AMD Xilinx
Package / Case
256-BBGA
Datasheet
Download
Description
IC FPGA 180 I/O 256BGA
Stock
45,132
In Stock :
45,132

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
256-BBGA
Number of Logic Blocks (LABs) :
1176
Max Operating Temperature :
85°C
Number of I/O :
180
Number of Gates :
236666
Mount :
Surface Mount
Packaging :
Tray
Voltage - Supply :
2.375V~2.625V
Total RAM Bits :
57344
Supplier Device Package :
256-PBGA (27x27)
Operating Temperature :
0°C~85°C TJ
RAM Size :
7kB
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
5292
RoHS Status :
Non-RoHS Compliant
Base Part Number :
XCV200
Series :
Virtex®
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Min Operating Temperature :
0°C
Lead Free :
Contains Lead
Published :
2002
Number of LABs/CLBs :
1176
Number of Pins :
256
Datasheets
XCV200-4BG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200-4BG256C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BBGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:XCV200, Number of Pins:256, XCV200-4BG256C pinout, XCV200-4BG256C datasheet PDF, XCV200-4BG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV200-4BG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV200-4BG256C


FPGAs AMD Xilinx XCV200-4BG256C Overview

The AMD Xilinx XCV200-4BG256C FPGA is a powerful field programmable gate array designed to meet the demands of high-speed and high-density applications across various industries. This device offers a robust architecture, equipped with 180 I/O pins and packaged neatly in a 256BGA format. It's engineered to deliver exceptional performance and flexibility, making it an ideal choice for developers and engineers looking for a scalable and efficient solution for their complex designs. The XCV200-4BG256C provides ample opportunities for customization and is adept at handling multiple functionalities concurrently, ensuring optimal use of board space and power.

XCV200-4BG256C Features

This FPGA boasts numerous features that make it a standout choice for a wide range of applications. Key attributes include its high I/O pin count which allows for extensive interfacing capabilities, a compact 256-ball grid array package that facilitates efficient use of PCB space, and the ability to reprogram the silicon for specific tasks which adds immense value in rapidly changing technological landscapes. The XCV200-4BG256C also supports a variety of standard and proprietary protocols, ensuring it can be integrated into diverse systems with minimal compatibility issues.

XCV200-4BG256C Applications

  • Telecommunications: Utilized in network switches and router infrastructure to manage data flow efficiently and adapt to new protocols as technology evolves.
  • Consumer Electronics: Key component in high-performance gaming consoles and home entertainment systems, where its ability to rapidly process multiple inputs and outputs enhances user experience.
  • Automotive: Integrated into driver assistance systems where real-time processing is crucial for sensor data and decision-making on the road.
  • Industrial Automation: Employed in control systems for factories and plants, providing the processing power needed to coordinate complex machinery and production processes.
  • Medical Devices: Forms the backbone of imaging systems like MRI and ultrasound machines, offering the flexibility to upgrade capabilities and improve diagnostic accuracy through advanced signal processing.
This HTML content effectively showcases the AMD Xilinx XCV200-4BG256C FPGA, emphasizing its adaptability, robust features, and wide range of applications, making it appealing for bulk B2B purchases.
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